Details

---

BUY BTS728L2 https://www.utsource.net/itm/p/12541691.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Supply Voltage	VIN	4.5	-	30	V	-
Continuous Output Current	IOUT	-	10	16	A	-
Peak Output Current	IOUT(peak)	-	-	24	A	-
Thermal Shutdown Temperature	TSD	-	160	180	°C	-
Operating Temperature	TA	-40	-	125	°C	-
Storage Temperature	TSTG	-40	-	150	°C	-
Junction-to-Ambient Thermal Resistance	RθJA	-	35	-	K/W	-
Control Input Voltage (High)	VIN(High)	4.5	-	30	V	-
Control Input Voltage (Low)	VIN(Low)	0	-	0.4	V	-
Quiescent Current	IQ	-	1.5	2.5	mA	-
Short-Circuit Protection	-	-	-	-	-	Active
Overtemperature Protection	-	-	-	-	-	Active

Instructions for Use:

1. Supply Voltage (V_IN):

   • Ensure the supply voltage is within the range of 4.5V to 30V.
   • Exceeding this range can damage the device.

2. Continuous Output Current (I_OUT):

   • The device can handle a continuous current of up to 10A, with a peak current of up to 16A.
   • For applications requiring higher currents, ensure adequate heat dissipation.

3. Thermal Management:

   • Monitor the junction temperature to avoid exceeding 160°C, which can trigger thermal shutdown.
   • Use a heatsink or other cooling methods if necessary.

4. Control Input:

   • Apply a high control input voltage (4.5V to 30V) to turn on the output.
   • Apply a low control input voltage (0V to 0.4V) to turn off the output.

5. Protection Features:

   • The device includes short-circuit and overtemperature protection.
   • These features will automatically shut down the device to prevent damage.

6. Operating and Storage Temperatures:

   • Operate the device within the temperature range of -40°C to 125°C.
   • Store the device within the temperature range of -40°C to 150°C.

7. Quiescent Current:

   • The quiescent current is typically 1.5mA and should not exceed 2.5mA.

8. Mounting and Handling:

   • Follow standard handling procedures to avoid static damage.
   • Ensure proper mounting to the PCB to maintain electrical and thermal performance.

9. Testing:

   • Before deploying the device in a final application, test it under typical operating conditions to ensure reliability.

For detailed specifications and additional information, refer to the datasheet provided by the manufacturer.

(For reference only)