Details

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BUY S29JL064J55TFI000 https://www.utsource.net/itm/p/12541838.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Storage Temperature Range		-65		150	°C
Operating Temperature Range		-40		85	°C
Supply Voltage (VCC)	VCC	2.7		3.6	V
Standby Current	ISB		1	5	μA	@ VCC = 3.0V, Ta = 25°C
Active Current	IAV		20	40	mA	@ VCC = 3.0V, Ta = 25°C, during read/write
Write Cycle Time	tWC		3.5	5	ms
Page Program Time	tPP		250	500	μs
Sector Erase Time	tSE		300	600	ms
Chip Erase Time	tCE		15	30	s
Data Retention			100		years	@ Ta = 85°C
Endurance (Write/Erase Cycles)			100		k cycles
Package Type			BGA			48-ball
Package Size			8		mm x 8 mm
Ball Pitch			0.8		mm

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (VCC) is within the range of 2.7V to 3.6V.
   • Connect the VCC pin to a stable power source.

2. Temperature Considerations:

   • The device operates reliably between -40°C and 85°C.
   • Store the device between -65°C and 150°C.

3. Current Consumption:

   • In standby mode, the current consumption should not exceed 5 μA.
   • During active operations (read/write), the current can reach up to 40 mA.

4. Timing Parameters:

   • Ensure that write cycle time (tWC) is at least 3.5 ms.
   • Page program time (tPP) should be between 250 μs and 500 μs.
   • Sector erase time (tSE) should be between 300 ms and 600 ms.
   • Chip erase time (tCE) should be between 15 seconds and 30 seconds.

5. Data Retention and Endurance:

   • The device retains data for up to 100 years at 85°C.
   • The endurance is rated for up to 100,000 write/erase cycles.

6. Package Handling:

   • The device is available in a 48-ball BGA package with a size of 8 mm x 8 mm.
   • The ball pitch is 0.8 mm.

7. Programming and Erasing:

   • Follow the specific command sequences for page programming and sector/chip erasing as detailed in the device datasheet.
   • Use appropriate programming algorithms to manage wear leveling and error correction.

8. Handling Precautions:

   • Handle the device with care to avoid damage to the BGA balls.
   • Use anti-static measures to prevent ESD damage.

For detailed command sequences and advanced features, refer to the full datasheet provided by the manufacturer.

(For reference only)