Details

---

BUY AMIS30532C5321RG https://www.utsource.net/itm/p/12541881.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Supply Voltage	VDD	4.75	5	5.25	V
Operating Temperature Range	Toper	-40		125	°C
Storage Temperature Range	Tstg	-65		150	°C
Output Current per Channel	Iout		500		mA
Maximum Power Dissipation	Pd			1.8	W
Thermal Resistance (θJA)	θJA		55		°C/W
Input Capacitance	Cin		10		pF
Output Low Voltage	VOL		0.4		V	@ IOL = 500mA
Output High Voltage	VOH		4.5		V	@ IOH = -500mA
Propagation Delay Time	tpd		25		ns
Power-On Reset Time	tPOR		100		μs
Enable Input Low to High Time	tELH		10		ns
Enable Input High to Low Time	tEHL		10		ns

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage is within the range of 4.75V to 5.25V.
   • Use appropriate decoupling capacitors close to the power pins to minimize noise and ensure stable operation.

2. Temperature Considerations:

   • The device can operate in temperatures ranging from -40°C to 125°C.
   • Store the device in temperatures between -65°C and 150°C.

3. Output Current:

   • Each channel can source or sink up to 500mA.
   • Ensure that the load does not exceed this limit to avoid damage.

4. Thermal Management:

   • The maximum power dissipation is 1.8W. Ensure adequate heat sinking if operating near this limit.
   • The thermal resistance (θJA) is 55°C/W. Use a heatsink if necessary to keep the junction temperature within safe limits.

5. Input and Output Levels:

   • The output low voltage (VOL) should be less than 0.4V when sourcing 500mA.
   • The output high voltage (VOH) should be greater than 4.5V when sinking 500mA.

6. Timing Parameters:

   • The propagation delay time (tpd) is typically 25ns.
   • The power-on reset time (tPOR) is typically 100μs.
   • The enable input low to high transition time (tELH) and high to low transition time (tEHL) are both typically 10ns.

7. Enable Pin:

   • The enable pin controls the operation of the device. Ensure proper logic levels are applied to this pin to enable or disable the outputs.

8. Handling and Storage:

   • Handle the device with care to avoid static discharge.
   • Store in a dry, cool place to prevent moisture damage.

9. Mounting and PCB Design:

   • Follow recommended PCB layout guidelines to ensure optimal performance and reliability.
   • Use ground planes and proper trace widths to minimize inductance and improve signal integrity.

(For reference only)