MC56F8167VPYE

MC56F8167VPYE

Category: IC Chips

Specifications
SKU
12542462
Details

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Parameter Description Min Typ Max Unit
VDD Supply Voltage 2.7 - 3.6 V
VIOL Input Low Voltage 0.0 - 0.8 V
VIOH Input High Voltage 2.0 - VDD V
IOL Output Sink Current - - 20 mA
IOH Output Source Current - - 20 mA
fCLK Clock Frequency 10 - 100 MHz
TA Operating Temperature Range -40 - 105 °C
TSTG Storage Temperature Range -65 - 150 °C
tPD Propagation Delay - 25 - ns
tSU Setup Time - 5 - ns
tH Hold Time - 2 - ns
IDD Active Current - 20 - mA
IDDQ Quiescent Current - 1 - μA

Instructions for Using the MC56F8167VPYE

  1. Power Supply:

    • Ensure that the supply voltage (VDD) is within the range of 2.7V to 3.6V.
    • Use a stable power source to avoid fluctuations that could affect performance.
  2. Input/Output Levels:

    • For digital inputs, ensure that the low-level input voltage (VIOL) does not exceed 0.8V and the high-level input voltage (VIOH) is at least 2.0V.
    • The output can sink or source up to 20mA of current.
  3. Clock Configuration:

    • The clock frequency (fCLK) should be set between 10MHz and 100MHz for optimal performance.
    • Use a crystal oscillator or an external clock source with the appropriate frequency.
  4. Temperature Considerations:

    • The operating temperature range (TA) is from -40°C to 105°C.
    • The storage temperature range (TSTG) is from -65°C to 150°C.
  5. Timing Parameters:

    • Ensure that the propagation delay (tPD) is considered when designing the system, as it is typically around 25ns.
    • Setup time (tSU) and hold time (tH) should be at least 5ns and 2ns, respectively, to avoid timing issues.
  6. Current Consumption:

    • The active current (IDD) is typically around 20mA.
    • The quiescent current (IDDQ) is very low, around 1μA, which helps in reducing power consumption during idle states.
  7. Handling and Storage:

    • Handle the device with care to avoid electrostatic discharge (ESD) damage.
    • Store the device in a dry, cool place within the specified storage temperature range.
  8. Programming and Configuration:

    • Use the appropriate development tools and software provided by the manufacturer to program and configure the device.
    • Refer to the datasheet and application notes for detailed programming instructions and examples.
  9. Testing and Validation:

    • After assembly, perform thorough testing under various conditions to ensure the device operates correctly.
    • Validate the design using test vectors and functional tests to confirm compliance with specifications.

For more detailed information, refer to the official datasheet and application notes provided by the manufacturer.

(For reference only)

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