Details
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| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Supply Voltage | Vcc | 2.7 | 5.0 | 5.5 | V | Operating supply voltage |
| Input Voltage Range | Vin | 0 | - | Vcc | V | Valid input voltage range |
| Output Current | Iout | - | 100 | 200 | mA | Maximum output current |
| Quiescent Current | Iq | - | 1.5 | 3.0 | mA | Current consumed by the IC itself |
| Shutdown Current | Ishd | - | 0.1 | 0.5 | μA | Current in shutdown mode |
| Output Voltage | Vout | 0.9 | - | Vcc-0.2 | V | Regulated output voltage |
| Dropout Voltage | Vdo | - | 0.2 | 0.4 | V | Voltage difference between Vin and Vout for regulation |
| Thermal Shutdown | Tsd | - | 150 | - | °C | Temperature at which the device shuts down to prevent damage |
| Operating Temperature | Topr | -40 | - | 85 | °C | Ambient temperature range |
| Storage Temperature | Tstg | -55 | - | 150 | °C | Temperature range for storage |
Instructions:
Power Supply:
- Ensure the supply voltage (Vcc) is within the specified range (2.7V to 5.5V).
- Connect the supply voltage to the Vcc pin and ground to the GND pin.
Input Voltage:
- The input voltage (Vin) should be within the valid range (0V to Vcc).
Output Configuration:
- Connect the load to the output pin (Vout).
- Ensure the load does not exceed the maximum output current (200mA).
Thermal Management:
- Monitor the operating temperature to ensure it stays within the specified range (-40°C to 85°C).
- If the device exceeds the thermal shutdown temperature (150°C), it will automatically shut down to prevent damage.
Shutdown Mode:
- To put the device into shutdown mode, apply a low signal to the shutdown pin (SHDN).
- In shutdown mode, the device consumes minimal current (0.1μA to 0.5μA).
Storage:
- Store the device in an environment where the temperature does not exceed the storage temperature range (-55°C to 150°C).
Handling:
- Handle the device with care to avoid static discharge, which can damage sensitive components.
- Follow proper soldering techniques to ensure reliable connections and avoid overheating during assembly.
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