STP45N65M5

STP45N65M5


Specifications
SKU
12542745
Details

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Below is the parameter table and instructions for the STP45N65M5, a 650V N-Channel Power MOSFET from STMicroelectronics.

STP45N65M5 Parameter Table

Parameter Symbol Min Typ Max Unit Conditions
Drain-Source Voltage VDSS - - 650 V -
Gate-Source Voltage VGSS -20 - 20 V -
Continuous Drain Current ID - - 45 A TC = 25°C
Pulsed Drain Current ID(m) - - 135 A tp = 10μs, IG = 1A, TC = 25°C
Power Dissipation PD - - 180 W TA = 25°C
RDS(on) RDS(on) - 0.78 1.1 Ω VGS = 10V, ID = 45A, TJ = 25°C
Input Capacitance Ciss - 1850 - pF VDS = 30V, f = 1MHz
Output Capacitance Coss - 330 - pF VDS = 30V, f = 1MHz
Gate Charge QG - 90 - nC VDS = 400V, ID = 10A, VGS = 15V
Threshold Voltage VGS(th) 2.0 3.5 5.0 V ID = 250μA, TJ = 25°C
Total Junction-to-Case Thermal Resistance RθJC - 0.5 - °C/W -
Total Junction-to-Ambient Thermal Resistance RθJA - 62 - °C/W -

Instructions for Use

  1. Handling and Storage:

    • ESD Protection: The device is sensitive to electrostatic discharge (ESD). Use proper ESD protection measures during handling and storage.
    • Storage Conditions: Store the device in a dry, cool place with controlled humidity and temperature.
  2. Mounting and Assembly:

    • Heat Sinking: For high power applications, ensure adequate heat sinking to maintain the junction temperature within safe limits.
    • Soldering: Follow the recommended soldering profile to avoid thermal damage. Use a maximum soldering temperature of 260°C for no more than 10 seconds.
  3. Electrical Connections:

    • Gate Drive: Ensure the gate drive circuit provides sufficient current to charge and discharge the gate capacitance quickly. Use a gate resistor to control the switching speed and reduce ringing.
    • Source Connection: Ensure a low-inductance path between the source terminal and the ground plane to minimize voltage spikes.
  4. Operating Conditions:

    • Temperature Range: Operate the device within the specified temperature range: TJ = -55°C to +150°C.
    • Voltage and Current Limits: Do not exceed the maximum ratings for VDSS, VGSS, ID, and PD.
  5. Testing and Troubleshooting:

    • Initial Testing: Before applying full load, perform initial testing at reduced power levels to verify proper operation.
    • Fault Conditions: Monitor the device for signs of overheating, excessive current, or voltage spikes. Use appropriate protective circuits to prevent damage.
  6. Design Considerations:

    • Parasitic Inductance: Minimize parasitic inductance in the circuit layout to reduce the risk of voltage overshoot and ringing.
    • Snubber Circuits: Consider using snubber circuits to protect against voltage transients, especially in high-frequency switching applications.

By following these guidelines, you can ensure reliable and efficient operation of the STP45N65M5 in your application.

(For reference only)

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