Details

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BUY FU024N https://www.utsource.net/itm/p/12542753.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Forward Voltage	VF	-	1.8	2.3	V	IF = 20mA, Ta = 25°C
Reverse Breakdown Voltage	VBR	200	-	-	V	IR = 1mA, Ta = 25°C
Continuous Forward Current	IF	-	-	30	mA	Ta = 25°C
Peak Forward Current	IF(surge)	-	-	100	mA	t = 10ms, Ta = 25°C
Reverse Current	IR	-	100	-	nA	VR = 200V, Ta = 25°C
Power Dissipation	PT	-	-	100	mW	Ta = 25°C
Operating Junction Temperature	TJ	-40	-	125	°C	-
Storage Temperature Range	TSTG	-65	-	150	°C	-

Instructions for Use:

1. Mounting:

   • Ensure the device is mounted on a suitable PCB with proper soldering to ensure good thermal and electrical connections.
   • Avoid mechanical stress on the leads during assembly.

2. Handling:

   • Handle the device with care to avoid damage to the leads or the body.
   • Use appropriate ESD (Electrostatic Discharge) protection when handling the device.

3. Operating Conditions:

   • Do not exceed the maximum ratings listed in the table.
   • Ensure that the operating temperature remains within the specified range to avoid thermal damage.

4. Soldering:

   • Use a soldering iron with a temperature of 350°C ± 50°C for a duration not exceeding 3 seconds per lead.
   • Allow the device to cool down before applying power.

5. Testing:

   • Test the device under controlled conditions to ensure it meets the specified parameters.
   • Use appropriate test equipment and methods to avoid damaging the device.

6. Storage:

   • Store the device in a dry, cool place away from direct sunlight and sources of heat.
   • Follow recommended storage conditions to maintain device reliability.

(For reference only)