Details

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Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	-	5	-	36	V
Quiescent Current	IQ	Per Amplifier, VCC = ±15V	-	4.2	-	mA
Input Bias Current	IB	VI = 0V	-	30	-	nA
Input Offset Current	IOS	VI = 0V	-	5	-	nA
Input Voltage Noise	en	f = 1kHz	-	3.5	-	nV/√Hz
Input Current Noise	in	f = 1kHz	-	2.5	-	pA/√Hz
Large Signal Voltage Gain	AV	VCC = ±15V, RL = 2kΩ	100	-	140	dB
Slew Rate	SR	VCC = ±15V	1500	-	-	V/μs
Output Voltage Swing	VOUT	VCC = ±15V, RL = 1kΩ	±13	-	±14	V
Bandwidth	BW	VCC = ±15V, G = +1, RL = 1kΩ	-	20	-	MHz
Unity Gain Frequency	fT	VCC = ±15V	-	120	-	MHz

Instructions for Use:

1. Supply Voltage:

   • Ensure the supply voltage is within the range of 5V to 36V.
   • For optimal performance, use a dual supply (e.g., ±15V).

2. Quiescent Current:

   • The quiescent current per amplifier is typically 4.2mA at ±15V supply.

3. Input Bias and Offset Current:

   • The input bias current is typically 30nA, and the input offset current is typically 5nA.
   • Use high-impedance sources to minimize errors due to these currents.

4. Noise:

   • The input voltage noise is 3.5nV/√Hz and the input current noise is 2.5pA/√Hz at 1kHz.
   • These values are important for low-noise applications.

5. Gain and Bandwidth:

   • The large signal voltage gain is typically between 100dB and 140dB.
   • The bandwidth is 20MHz at a gain of +1 with a 1kΩ load.
   • The unity gain frequency is 120MHz.

6. Output Voltage Swing:

   • The output can swing from ±13V to ±14V with a 1kΩ load at ±15V supply.

7. Slew Rate:

   • The slew rate is 1500V/μs, which is crucial for high-frequency and large-signal applications.

8. Stability:

   • Use appropriate compensation capacitors if needed to ensure stability, especially at high gains.

9. Layout Considerations:

   • Keep power supply lines short and well-decoupled with capacitors (e.g., 0.1μF and 10μF) close to the device.
   • Use ground planes to reduce noise and improve thermal performance.

10. Handling:

    • Handle the device with care to avoid electrostatic discharge (ESD) damage.
    • Follow proper soldering techniques to prevent thermal stress on the device.

For detailed specifications and additional information, refer to the datasheet provided by the manufacturer.

(For reference only)