53C80

53C80


Specifications
SKU
12542777
Details

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Parameter Description Value Unit
Supply Voltage (VCC) Operating supply voltage range 4.75 to 5.25 V
Operating Temperature Range for commercial grade 0 to 70 °C
Industrial Temperature Range for industrial grade -40 to 85 °C
Data Rate Maximum data transfer rate 20 MB/s
Output Drive Capability Maximum output current ±24 mA
Input Threshold High-level input voltage 2.0 V
Low-level input voltage 0.8 V
Propagation Delay Maximum propagation delay time 10 ns
Power Consumption Typical power consumption at 5V 200 mW
Storage Temperature Range for storage -65 to 150 °C
Package Type Common package types PLCC-44, PQFP

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage is within the specified range (4.75V to 5.25V).
    • Use decoupling capacitors (0.1μF and 10μF) close to the VCC and GND pins to minimize noise.
  2. Temperature Considerations:

    • For commercial applications, operate within 0°C to 70°C.
    • For industrial applications, operate within -40°C to 85°C.
    • Store the device between -65°C and 150°C.
  3. Data Transfer:

    • The device supports a maximum data transfer rate of 20 MB/s.
    • Ensure all connected devices support this data rate to avoid performance bottlenecks.
  4. Input and Output Levels:

    • High-level input voltage should be at least 2.0V.
    • Low-level input voltage should be no more than 0.8V.
    • The output can drive up to ±24mA.
  5. Propagation Delay:

    • The maximum propagation delay is 10ns. This is crucial for timing-sensitive applications.
  6. Power Consumption:

    • The typical power consumption is 200mW at 5V. Ensure adequate cooling if operating in high-temperature environments.
  7. Package Handling:

    • Handle the device with care to avoid damage.
    • Use appropriate ESD protection when handling the device.
  8. Mounting and Soldering:

    • Follow standard PCB assembly guidelines for PLCC-44 or PQFP packages.
    • Use a reflow soldering profile suitable for the package type.
  9. Testing:

    • After assembly, perform functional tests to ensure proper operation.
    • Check for any shorts or open circuits on the PCB.
  10. Compliance:

    • Ensure compliance with relevant standards and regulations for your application.
(For reference only)

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