Details

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BUY FZE1066G https://www.utsource.net/itm/p/12542784.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Forward Voltage	VF	-	1.8	2.2	V	IF = 20mA
Reverse Current	IR	-	-	100	nA	VR = 5V, TA = 25°C
Continuous Forward Current	IF	-	-	30	mA	TA = 25°C
Peak Forward Current	IF(surge)	-	-	100	mA	TA = 25°C, t = 10ms, Repetition Rate = 10%
Operating Temperature Range	TA	-40	-	85	°C	-
Storage Temperature Range	TSTG	-40	-	125	°C	-
Junction Temperature	TJ	-	-	150	°C	-

Instructions for Use:

1. Forward Voltage (V_F):

   • Ensure that the forward voltage across the diode does not exceed 2.2V when the forward current is 20mA to avoid damage.

2. Reverse Current (I_R):

   • The reverse current should not exceed 100nA at a reverse voltage of 5V and an ambient temperature of 25°C to prevent leakage issues.

3. Continuous Forward Current (I_F):

   • Do not exceed 30mA of continuous forward current at an ambient temperature of 25°C to avoid overheating.

4. Peak Forward Current (I_F(surge)):

   • The peak forward current can be up to 100mA but only for a duration of 10ms with a repetition rate of 10% to prevent thermal stress.

5. Operating Temperature Range (T_A):

   • The device is designed to operate within a temperature range of -40°C to 85°C. Ensure that the ambient temperature remains within this range during operation.

6. Storage Temperature Range (T_STG):

   • Store the device in an environment where the temperature ranges from -40°C to 125°C to maintain its performance and reliability.

7. Junction Temperature (T_J):

   • The maximum junction temperature should not exceed 150°C to prevent thermal damage. Ensure adequate heat dissipation if operating near this limit.

Handling and Storage:

• Handle the device with care to avoid mechanical damage.
• Store the device in a dry, cool place to prevent moisture damage.
• Follow ESD (Electrostatic Discharge) precautions to avoid damaging the device.

Mounting and Soldering:

• Use appropriate soldering techniques to ensure a reliable connection.
• Avoid excessive heat during soldering to prevent thermal damage.
• Ensure proper alignment and orientation of the device during mounting.

Testing:

• Test the device under controlled conditions to verify its performance.
• Use the specified test conditions to ensure accurate results.

Safety:

• Always follow safety guidelines and regulations when handling and using electronic components.
• Ensure that the device is used in applications where it will not cause harm or injury.

(For reference only)