Details

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BUY 12C671/P https://www.utsource.net/itm/p/12542796.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	Vcc	2.0	5.0	5.5	V	Operating voltage range
Operating Current	ICC	-	1.2	3.0	mA	Typical current consumption
Output High Voltage	VOH	2.4	-	Vcc	V	Voltage at output when high
Output Low Voltage	VOL	0	-	0.4	V	Voltage at output when low
Input Voltage Range	VIH	2.0	-	Vcc	V	Valid input voltage for logic high
Input Voltage Low	VIL	0	-	0.8	V	Valid input voltage for logic low
Input Leakage Current	IIL	-1	0	1	μA	Maximum leakage current at input
Output Sink Current	IOL	-	20	25	mA	Maximum current output can sink
Output Source Current	IOH	-	10	15	mA	Maximum current output can source
Storage Temperature	Tstg	-65	-	150	°C	Temperature range for storage
Operating Temperature	Topr	-40	-	85	°C	Temperature range for operation

Instructions for Use

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the specified range of 2.0V to 5.5V.
   • Connect the Vcc pin to the positive terminal of your power supply and the GND pin to the ground.

2. Input Signals:

   • Apply input signals (VIH and VIL) within the valid input voltage ranges to ensure proper logic levels.
   • Ensure input signals do not exceed Vcc or go below GND to avoid damage.

3. Output Handling:

   • The output pins (VOH and VOL) should be connected to loads that can handle the specified sink and source currents.
   • Do not exceed the maximum output sink current (IOL) of 25mA or the maximum output source current (IOH) of 15mA.

4. Temperature Considerations:

   • Operate the device within the operating temperature range (-40°C to 85°C) to ensure reliable performance.
   • Store the device within the storage temperature range (-65°C to 150°C).

5. Current Consumption:

   • Monitor the operating current (ICC) to ensure it does not exceed 3.0mA under typical conditions.

6. Handling and Storage:

   • Handle the device with care to avoid static discharge, which can damage sensitive components.
   • Store the device in a dry, cool environment to prevent moisture damage.

7. Testing:

   • Before integrating the device into a circuit, perform initial testing to verify its functionality and adherence to the specified parameters.

(For reference only)