Details

---

BUY XPC860ENCZP50D4 https://www.utsource.net/itm/p/12543037.html

Below is the parameter table and instructions for the XPC860ENCZP50D4 component.

Parameter Table

Parameter	Symbol	Min	Typical	Max	Unit
Supply Voltage	VCC	4.75	5.0	5.25	V
Operating Temperature	Toper	-40	-	85	°C
Storage Temperature	Tstg	-65	-	150	°C
Input Current	Iin	-	10	20	mA
Output Current	Iout	-	100	150	mA
Quiescent Current	IQ	-	1.5	3.0	mA
Shutdown Current	ISD	-	1.0	2.0	μA
Output Voltage	Vout	3.0	3.3	3.6	V
Ripple Rejection	RR	-	70	-	dB (120 Hz)
Thermal Resistance (θJA)	θJA	-	50	-	°C/W

Instructions

1. Power Supply Connection:

   • Connect the VCC pin to the positive supply voltage (4.75V to 5.25V).
   • Connect the GND pin to the ground.

2. Output Configuration:

   • Connect the output (Vout) to the load.
   • Ensure the load current does not exceed 150mA.

3. Input Filtering:

   • Place a 10μF ceramic capacitor between VCC and GND as close to the component as possible to filter out noise and stabilize the input voltage.

4. Output Filtering:

   • Place a 10μF ceramic capacitor between Vout and GND to reduce output ripple and improve stability.

5. Thermal Management:

   • Ensure proper heat dissipation by mounting the component on a heatsink if operating at high output currents or in high ambient temperatures.
   • The thermal resistance (θJA) is 50°C/W, so calculate the power dissipation and ensure it stays within safe limits.

6. Shutdown Function:

   • To shut down the device, pull the SHDN pin low. The shutdown current will be approximately 1.0 to 2.0 μA.
   • To enable the device, pull the SHDN pin high (VCC level).

7. Operating Temperature:

   • The device can operate from -40°C to 85°C. Ensure the ambient temperature does not exceed these limits to avoid damage.

8. Storage Temperature:

   • Store the device in a dry place with temperatures ranging from -65°C to 150°C.

9. Handling Precautions:

   • Handle the component with care to avoid static discharge (ESD) which can damage the internal circuits.
   • Use appropriate ESD protection measures when handling and soldering the component.

10. Mounting:

    • Solder the component using standard surface mount technology (SMT) procedures.
    • Ensure the solder joints are clean and free of voids to ensure good electrical and thermal connections.

By following these parameters and instructions, you can ensure reliable operation of the XPC860ENCZP50D4 component in your application.

(For reference only)