Details
BUY IRFB5615PBF IRFB5615 TO-220 https://www.utsource.net/itm/p/12543103.html
| Parameter | Symbol | Min | Typ | Max | Unit | Notes |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | - | - | 55 | V | |
| Gate-Source Voltage | VGS | -20 | - | 20 | V | |
| Continuous Drain Current | ID | - | 19.3 | - | A | @ TC = 25°C |
| Continuous Drain Current | ID | - | 14.7 | - | A | @ TC = 100°C |
| Pulse Drain Current | ID(pulse) | - | 48.2 | - | A | @ TC = 25°C, tp = 10μs, Duty Cycle = 1% |
| Total Power Dissipation | PTOT | - | - | 150 | W | @ TA = 25°C |
| Junction Temperature | TJ | - | - | 175 | °C | |
| Storage Temperature Range | TSTG | -65 | - | 150 | °C | |
| Thermal Resistance, Junction to Case | RθJC | - | 0.55 | - | °C/W | |
| Input Capacitance | Ciss | - | 1900 | - | pF | @ VDS = 10V, f = 1MHz |
| Output Capacitance | Coss | - | 560 | - | pF | @ VDS = 10V, f = 1MHz |
| Gate Charge | QG | - | 120 | - | nC | @ VDS = 10V, ID = 10A |
| Threshold Voltage | VGS(th) | 2.0 | 2.5 | 3.0 | V | @ ID = 250μA |
| On-State Resistance | RDS(on) | - | 0.0058 | - | Ω | @ VGS = 10V, ID = 19.3A |
Instructions for Use:
Handling Precautions:
- Handle the device with care to avoid damage to the leads and the die.
- Use appropriate ESD (Electrostatic Discharge) protection measures when handling the device.
Mounting:
- Ensure that the mounting surface is clean and flat to maximize thermal performance.
- Use a suitable heat sink or cooling solution to manage the junction temperature, especially under high current conditions.
Soldering:
- Use a soldering iron with a temperature not exceeding 300°C.
- Soldering time should be kept to a minimum to avoid thermal damage to the device.
Biasing:
- Apply the gate-source voltage (VGS) within the specified limits to avoid damaging the gate oxide.
- Ensure that the gate-source voltage is sufficient to fully turn on the MOSFET and minimize on-state resistance.
Operation:
- Monitor the drain current (ID) and power dissipation (PTOT) to ensure they do not exceed the maximum ratings.
- Keep the junction temperature (TJ) below the maximum rating to prevent thermal runaway.
Storage:
- Store the device in a dry, cool place away from direct sunlight and sources of heat.
- Follow the storage temperature range (TSTG) to ensure long-term reliability.
Testing:
- Use a multimeter or an oscilloscope to verify the electrical parameters such as VGS, VDS, and ID.
- Perform functional tests to ensure the device operates correctly under the intended operating conditions.
By following these guidelines, you can ensure optimal performance and longevity of the IRFB5615PBF IRFB5615 TO-220 MOSFET.
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