Details

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BUY TLE42702SAKSA1 https://www.utsource.net/itm/p/12543628.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VCC	4.5	5.0	5.5	V	Operating voltage range
Output Current (Sink)	IO(Sink)	-	30	-	mA	Maximum current that can be sunk by the output
Output Current (Source)	IO(Source)	-	20	-	mA	Maximum current that can be sourced by the output
Input Voltage	VI	0	-	5.5	V	Input voltage range
Input Leakage Current	IIL	-	1	5	μA	Maximum leakage current at input pins
Output Low Voltage	VOL	0	0.4	0.6	V	Voltage at output when low
Output High Voltage	VOH	4.4	4.8	5.0	V	Voltage at output when high
Propagation Delay Time	tpd	2	5	8	ns	Time delay from input to output
Storage Temperature	Tstg	-40	-	125	°C	Temperature range for storage
Operating Temperature	TA	-40	-	125	°C	Ambient temperature range for operation
Thermal Resistance (θJA)	θJA	-	150	-	K/W	Junction-to-ambient thermal resistance

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the specified range of 4.5V to 5.5V.
   • Connect a decoupling capacitor (typically 100nF) close to the power supply pins to minimize noise.

2. Input Handling:

   • Input voltages should not exceed the supply voltage (V_CC).
   • Avoid floating input pins; they should be either pulled up or down to a defined logic level.

3. Output Handling:

   • Do not exceed the maximum output current ratings (30mA sink, 20mA source).
   • When driving inductive loads, use flyback diodes to protect against voltage spikes.

4. Thermal Management:

   • Ensure adequate cooling if operating at high temperatures or high current levels.
   • Monitor the junction temperature to ensure it does not exceed the maximum allowable temperature.

5. Storage and Handling:

   • Store the device in a dry, cool place within the specified storage temperature range (-40°C to 125°C).
   • Handle with care to avoid static damage; use ESD protection measures.

6. Mounting:

   • Follow recommended PCB layout guidelines to ensure optimal performance and reliability.
   • Use proper soldering techniques to avoid damage to the device during assembly.

7. Testing:

   • Before finalizing the design, perform thorough testing under all expected operating conditions to ensure reliable operation.

(For reference only)