Details

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BUY PM25CLS120 https://www.utsource.net/itm/p/12543761.html

Parameter	Description	Value	Unit
Part Number	Device Identifier	PM25CLS120	-
Type	Component Type	MOSFET	-
VDS	Drain-Source Voltage	1200	V
VGS	Gate-Source Voltage	±20	V
ID	Continuous Drain Current	25	A
RDS(on)	On-State Resistance at VGS=10V	75	mΩ
QG	Total Gate Charge	165	nC
Eoss	Output Capacitance Energy	45	nJ
TJ	Junction Temperature Range	-55 to 150	°C
Package	Housing Type	TO-247-3L	-
Mounting	Mounting Style	Through-Hole	-

Instructions for Use:

1. Handling Precautions:

   • Handle the device with care to avoid mechanical damage.
   • Use appropriate ESD (Electrostatic Discharge) protection to prevent damage to the MOSFET.

2. Mounting:

   • Ensure that the device is securely mounted to the PCB (Printed Circuit Board) using the recommended torque for the screws.
   • Use thermal paste or a thermal pad to enhance heat dissipation if necessary.

3. Biasing:

   • Apply the gate-source voltage (V_GS) within the specified range of ±20V to ensure proper operation.
   • Avoid exceeding the maximum drain-source voltage (V_DS) of 1200V to prevent breakdown.

4. Current Limiting:

   • Do not exceed the continuous drain current (I_D) of 25A to prevent overheating and potential failure.
   • Consider derating the current based on the operating temperature and cooling conditions.

5. Thermal Management:

   • Monitor the junction temperature (T_J) to ensure it stays within the range of -55°C to 150°C.
   • Use heatsinks or forced air cooling if the device operates at high power levels.

6. Storage:

   • Store the device in a dry, cool place to prevent moisture damage.
   • Keep the device in its original packaging until ready for use to protect against static discharge.

7. Testing:

   • Perform initial testing at low power levels to verify correct operation before applying full load conditions.
   • Use a multimeter or oscilloscope to check the device parameters such as V_DS, V_GS, and I_D.

8. Soldering:

   • Follow the recommended soldering profile to avoid thermal shock and damage to the device.
   • Ensure that the solder joints are clean and free from voids or cold solder joints.

(For reference only)