Details

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Parameter	Description	Value
Device Type	High-Definition Audio Codec with Headphone Amplifier	-
Package Type	64-QFN (9x9mm)	-
Operating Voltage (VDD)	Supply Voltage for Digital Core and Analog Sections	2.5V to 3.6V
I/O Voltage (VIO)	Supply Voltage for I/O Pins	1.8V to 3.6V
Analog Input Channels	Number of Analog Input Channels	4 (2 Stereo Pairs)
Analog Output Channels	Number of Analog Output Channels	6 (3 Stereo Pairs)
Digital Audio Interfaces	Supported Digital Audio Interfaces	I2S, TDM, PDM, S/PDIF
Headphone Amplifier	Maximum Output Power into 32Ω Load	15.5mW per channel
SNR (Signal-to-Noise Ratio)	SNR for Analog Inputs and Outputs	100dB (A-Weighted)
THD+N (Total Harmonic Distortion + Noise)	THD+N for Analog Inputs and Outputs at 1kHz, 0dBFS, 32Ω Load	0.002%
Operating Temperature	Operating Temperature Range	-40°C to +85°C
Storage Temperature	Storage Temperature Range	-65°C to +150°C
ESD Protection	Electrostatic Discharge Protection Level	HBM: ±4kV, MM: ±2kV

Instructions for Use:

1. Power Supply:

   • Connect VDD to a stable power supply between 2.5V and 3.6V.
   • Connect VIO to a stable power supply between 1.8V and 3.6V.
   • Ensure proper decoupling capacitors (0.1μF and 10μF) are placed close to the power pins.

2. Analog Connections:

   • Connect analog input signals to the appropriate INP and INN pins.
   • Connect analog output signals from the OUTP and OUTN pins to the desired load.

3. Digital Audio Interfaces:

   • Configure the digital audio interface (I2S, TDM, PDM, S/PDIF) using the control registers.
   • Ensure correct signal levels and timing for the selected interface.

4. Headphone Amplifier:

   • Connect headphones to the HPLOUT and HPROUT pins.
   • Set the gain and enable the amplifier through the control registers.

5. Software Configuration:

   • Use the I2C or SPI interface to configure the codec.
   • Refer to the datasheet for register addresses and bit configurations.

6. Thermal Management:

   • Ensure adequate heat dissipation by providing a thermal pad on the PCB.
   • Follow recommended PCB layout guidelines for optimal thermal performance.

7. Testing and Validation:

   • Perform initial testing with known good signals to verify functionality.
   • Use audio analysis tools to measure SNR, THD+N, and other performance metrics.

8. Handling Precautions:

   • Handle the device with care to avoid ESD damage.
   • Store the device in a controlled environment to prevent moisture and temperature-related issues.

(For reference only)