Details

---

BUY IXFH44N50P https://www.utsource.net/itm/p/12553464.html

Parameter	Symbol	Value	Unit
Maximum Drain-Source Voltage	VDS(max)	500	V
Maximum Gate-Source Voltage	VGS(max)	±20	V
Maximum Drain Current (Pulsed)	ID(max) (pulsed)	44	A
Maximum Drain Current (Continuous)	ID(max) (continuous)	16.7	A
Total Power Dissipation	PTOT	185	W
Junction Temperature Range	TJ	-55 to +175	°C
Storage Temperature Range	TSTG	-55 to +175	°C
Thermal Resistance, Junction to Case	RθJC	0.5	°C/W
Gate Charge	QG	113	nC
Input Capacitance	Ciss	2000	pF
Output Capacitance	Coss	340	pF
Reverse Transfer Capacitance	Crss	180	pF

Instructions for Use:

1. Voltage Handling:

   • Ensure that the drain-source voltage (V_DS) does not exceed 500V.
   • The gate-source voltage (V_GS) should be kept within ±20V.

2. Current Handling:

   • For pulsed applications, the maximum drain current (I_D) is 44A.
   • For continuous operation, the maximum drain current is 16.7A.

3. Power Dissipation:

   • The total power dissipation (P_TOT) should not exceed 185W.

4. Temperature Management:

   • The junction temperature (T_J) should be maintained between -55°C and +175°C.
   • Store the device in an environment with temperatures ranging from -55°C to +175°C.

5. Thermal Considerations:

   • The thermal resistance from the junction to the case (R_θJC) is 0.5°C/W. Proper heat sinking may be required to manage heat dissipation effectively.

6. Capacitance and Gate Charge:

   • The input capacitance (C_iss) is 2000pF, the output capacitance (C_oss) is 340pF, and the reverse transfer capacitance (C_rss) is 180pF.
   • The gate charge (Q_G) is 113nC, which affects switching performance and drive requirements.

7. Mounting and Handling:

   • Handle the device with care to avoid mechanical damage.
   • Follow proper soldering techniques to ensure reliable connections and prevent thermal shock.

8. Testing and Verification:

   • Verify all parameters using appropriate test equipment before final assembly.
   • Ensure that the device is tested under conditions that simulate its intended operating environment.

(For reference only)