NCP1117ST50T3G

NCP1117ST50T3G


Specifications
SKU
12553474
Details

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Parameter Symbol Min Typical Max Unit
Input Voltage VIN 7.0 - 20.0 V
Output Voltage VOUT 5.0 - 5.0 V
Output Current IOUT - 1.0 1.0 A
Dropout Voltage VDROPOUT - 1.5 2.0 V
Quiescent Current IQ - 6.5 8.0 mA
Ground Pin Current IGND - 8.0 10.0 mA
Power Dissipation PD - - 1000 mW
Operating Temperature TOPR -40 - 125 °C
Storage Temperature TSTG -65 - 150 °C
Thermal Resistance (θJA) θJA - 50 - °C/W

Instructions for Use:

  1. Input Voltage (VIN):

    • Ensure the input voltage is within the range of 7.0V to 20.0V to avoid damage to the regulator.
  2. Output Voltage (VOUT):

    • The output voltage is fixed at 5.0V. No external components are required to set this voltage.
  3. Output Current (IOUT):

    • The maximum continuous output current is 1.0A. Ensure the load does not exceed this limit to prevent overheating or damage.
  4. Dropout Voltage (VDROPOUT):

    • The dropout voltage is the minimum difference between the input and output voltages required to maintain regulation. It is typically 1.5V to 2.0V.
  5. Quiescent Current (IQ):

    • The quiescent current is the current consumed by the regulator when no load is applied. It is typically 6.5mA to 8.0mA.
  6. Ground Pin Current (IGND):

    • The ground pin current is the current flowing through the ground pin. It is typically 8.0mA to 10.0mA.
  7. Power Dissipation (PD):

    • The maximum power dissipation is 1000mW. Ensure proper heat sinking if the regulator is operating near this limit to prevent thermal shutdown.
  8. Operating Temperature (TOPR):

    • The operating temperature range is from -40°C to 125°C. Ensure the ambient temperature and heat dissipation are managed to keep the regulator within this range.
  9. Storage Temperature (TSTG):

    • The storage temperature range is from -65°C to 150°C. Store the device in a dry environment to prevent moisture damage.
  10. Thermal Resistance (θJA):

    • The thermal resistance from junction to ambient (θJA) is 50°C/W. Use a heatsink if the power dissipation is high to reduce the junction temperature.

Additional Notes:

  • Capacitors:
    • Use a 10μF tantalum or ceramic capacitor on the input side and a 10μF tantalum or ceramic capacitor on the output side to ensure stability and filter out noise.
  • PCB Layout:
    • Keep the PCB layout compact and use wide traces for the input and output to minimize voltage drops and improve thermal performance.
  • Heat Sinking:
    • If the regulator is expected to dissipate significant power, consider using a heatsink or a larger copper area on the PCB to enhance heat dissipation.
(For reference only)

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