TJA1085HN,118

TJA1085HN,118

Category: IC Chips

Specifications
SKU
12555221
Details

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Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VCC 3.6 5.0 5.5 V
Operating Temperature Range TOP -40 125 °C
Storage Temperature Range TSTG -65 150 °C
Standby Current ICC(STBY) 15 μA VCC = 5V, TXD = GND
Quiescent Current ICC(Q) 1.0 mA VCC = 5V, TXD = GND
Receiver Input Impedance RLIN 10
Receiver Input Voltage Range VIN -2 7 V
Differential Output Voltage (High) VODH 1.5 V VCC = 5V, RL = 60Ω
Differential Output Voltage (Low) VODL -1.5 V VCC = 5V, RL = 60Ω
Common-Mode Output Voltage VOCM 2.5 V VCC = 5V, RL = 60Ω
Maximum Data Rate fD 10 Mbps
Rise Time tR 20 ns
Fall Time tF 20 ns
Propagation Delay tPD 15 ns
Skew tSK 15 ns

Instructions for TJA1085HN,118

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the specified range of 3.6V to 5.5V.
    • Use a stable power source to avoid fluctuations that could affect performance.
  2. Temperature Considerations:

    • Operate the device within the temperature range of -40°C to 125°C.
    • Store the device in a temperature range of -65°C to 150°C.
  3. Standby Mode:

    • To minimize power consumption, set the TXD pin to GND when not transmitting data.
    • The standby current (ICC(STBY)) should be around 15 μA at 5V.
  4. Receiver Operation:

    • The receiver input impedance (RLIN) is approximately 10 kΩ.
    • Ensure the receiver input voltage (VIN) stays within the range of -2V to 7V to avoid damage.
  5. Transmitter Operation:

    • The differential output voltage (VODH and VODL) should be 1.5V and -1.5V, respectively, when VCC is 5V and the load resistance (RL) is 60Ω.
    • The common-mode output voltage (VOCM) should be around 2.5V under the same conditions.
  6. Data Transmission:

    • The maximum data rate supported is 10 Mbps.
    • Ensure the rise time (tR) and fall time (tF) are within 20 ns to maintain signal integrity.
  7. Timing Parameters:

    • The propagation delay (tPD) should be around 15 ns.
    • The skew (tSK) should also be around 15 ns to ensure proper synchronization.
  8. Installation and Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow standard PCB design practices to ensure optimal performance and reliability.
  9. Testing and Validation:

    • Before deploying the device in a final application, conduct thorough testing to verify all parameters and ensure compliance with specifications.
  10. Compliance and Certification:

    • Ensure the device meets all relevant industry standards and certifications for the intended application.
(For reference only)

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