Details

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BUY IR2117PBF https://www.utsource.net/itm/p/12555554.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Supply Voltage	VCC	4.5	-	20	V
Logic Input High Level	VIH	2.0	-	VCC	V
Logic Input Low Level	VIL	-	-	0.8	V
High-Side Driver Output	VHO	-	-	VB - 3	V
Low-Side Driver Output	VLO	-	-	VS - 0.5	V
Floating Channel Operation	-	-	-	600	V
Gate Drive Current	IG	-	卤1.5	-	A
Quiescent Current	IQ	-	1.5	-	mA
Shutdown Current	ISD	-	0.01	-	渭A
Propagation Delay	td	-	80	-	ns
Rise Time	tr	-	35	-	ns
Fall Time	tf	-	35	-	ns
Operating Temperature Range	TA	-40	-	125	掳C

Instructions for Using IR2117PBF

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the range of 4.5V to 20V to avoid damage to the device.

2. Logic Inputs:

   • The logic input high level (V_IH) should be at least 2.0V and can go up to the supply voltage (V_CC).
   • The logic input low level (V_IL) should not exceed 0.8V.

3. Driver Outputs:

   • The high-side driver output (V_HO) will be V_B - 3V.
   • The low-side driver output (V_LO) will be V_S - 0.5V.

4. Floating Channel Operation:

   • The device supports floating channel operation up to 600V, making it suitable for high-voltage applications.

5. Gate Drive Current:

   • The gate drive current (I_G) can source or sink up to 卤1.5A.

6. Quiescent and Shutdown Current:

   • The quiescent current (I_Q) is typically 1.5mA.
   • The shutdown current (I_SD) is very low, typically 0.01渭A.

7. Timing Parameters:

   • The propagation delay (t_d) is typically 80ns.
   • The rise time (t_r) and fall time (t_f) are both typically 35ns.

8. Operating Temperature:

   • The operating temperature range (T_A) is from -40掳C to 125掳C.

9. Mounting and Handling:

   • Handle the device with care to avoid static discharge and physical damage.
   • Ensure proper heat dissipation if used in high-power applications.

10. Circuit Design:

    • Use appropriate decoupling capacitors near the power supply pins to stabilize the supply voltage.
    • Ensure that the bootstrap capacitor is correctly sized and placed to maintain the high-side gate drive.

11. Testing and Validation:

    • Test the circuit under all expected operating conditions to ensure reliable performance.
    • Verify that the device is properly protected against overvoltage, overcurrent, and thermal stress.

(For reference only)