Details

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BUY FDA24N50F https://www.utsource.net/itm/p/12555559.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Drain-Source Voltage	VDS	-	-	500	V	Maximum voltage between drain and source
Gate-Source Voltage	VGS	-15	-	15	V	Maximum voltage between gate and source
Continuous Drain Current	ID	-	24	-	A	Continuous current through the drain
Pulse Drain Current	ID(pulse)	-	60	-	A	Peak pulse current through the drain (tpw = 10 渭s)
Power Dissipation	PTOT	-	-	300	W	Maximum total power dissipation
Junction Temperature	TJ	-	-	175	掳C	Maximum junction temperature
Storage Temperature	TSTG	-65	-	150	掳C	Operating temperature range
Thermal Resistance, Junction to Case	R胃JC	-	0.45	-	掳C/W	Thermal resistance from junction to case

Instructions for Use:

1. Voltage Ratings:

   • Ensure that the drain-source voltage (V_DS) does not exceed 500V.
   • The gate-source voltage (V_GS) should be within 卤15V.

2. Current Ratings:

   • The continuous drain current (I_D) should not exceed 24A.
   • For pulse conditions, the peak drain current (I_D(pulse)) can reach up to 60A for a pulse width of 10 渭s.

3. Power Dissipation:

   • The maximum total power dissipation (P_TOT) is 300W. Ensure adequate heat sinking to manage thermal dissipation.

4. Temperature Considerations:

   • The junction temperature (T_J) should not exceed 175掳C.
   • The device can operate over a storage temperature range from -65掳C to 150掳C.

5. Thermal Management:

   • The thermal resistance from the junction to the case (R_胃JC) is 0.45掳C/W. Proper heat sinking is essential to maintain the junction temperature within safe limits.

6. Handling and Storage:

   • Handle the device with care to avoid damage to the pins and the semiconductor structure.
   • Store the device in a dry, cool place to prevent moisture damage.

7. Mounting:

   • Follow the recommended mounting torque for the screws to ensure good thermal contact and mechanical stability.
   • Use a thermal interface material (TIM) to enhance heat transfer from the device to the heatsink.

8. Electrostatic Discharge (ESD) Protection:

   • Use appropriate ESD protection measures when handling the device to prevent damage from static electricity.

9. Circuit Design:

   • Ensure that the circuit design includes necessary protective components such as fuses, transient voltage suppressors (TVS), and snubbers to protect the device from overvoltage and overcurrent conditions.

10. Testing:

    • Perform initial testing at reduced voltages and currents to verify the correct operation of the device before operating at full specifications.

(For reference only)