MC14071BCP

MC14071BCP


Specifications
SKU
12591017
Details

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Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC - 2.0 5.0 6.0 V
Input Low Voltage VIL IL = 0.4 mA 0.8 - 1.5 V
Input High Voltage VIH IH = -0.4 mA 3.5 - 4.0 V
Output Low Voltage VOL IOL = 16 mA 0.4 - 0.5 V
Output High Voltage VOH IOH = -4 mA 2.4 - 3.4 V
Propagation Delay Time tpd VCC = 5V, TA = 25°C - 15 - ns
Power Dissipation PD - - - 100 mW
Operating Temperature Range TA - -40 - 85 °C
Storage Temperature Range TSTG - -65 - 150 °C

Instructions for Use

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 2.0V to 6.0V. The typical operating voltage is 5.0V.
  2. Input Voltage Levels:

    • For a logic low input (VIL), the voltage should be between 0.8V and 1.5V.
    • For a logic high input (VIH), the voltage should be between 3.5V and 4.0V.
  3. Output Voltage Levels:

    • When the output is low (VOL), it should be between 0.4V and 0.5V.
    • When the output is high (VOH), it should be between 2.4V and 3.4V.
  4. Propagation Delay Time (tpd):

    • The typical propagation delay time is 15 nanoseconds at 5V supply voltage and 25°C ambient temperature.
  5. Power Dissipation (PD):

    • The maximum power dissipation is 100 milliwatts. Ensure adequate heat sinking if operating near this limit.
  6. Operating Temperature Range (TA):

    • The device can operate within a temperature range of -40°C to 85°C.
  7. Storage Temperature Range (TSTG):

    • The device can be stored in temperatures ranging from -65°C to 150°C.
  8. Handling and Storage:

    • Handle the device with care to avoid static damage. Use proper ESD protection when handling.
    • Store the device in a dry environment to prevent moisture damage.
  9. Mounting and Soldering:

    • Follow recommended soldering profiles to ensure reliable connections.
    • Avoid excessive heat during soldering to prevent damage to the device.
  10. Testing:

    • Test the device under specified conditions to ensure it meets performance specifications.
    • Use appropriate test equipment and procedures to avoid damaging the device.

For detailed application notes and further information, refer to the datasheet provided by the manufacturer.

(For reference only)

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