ISL95829AHRTZ

ISL95829AHRTZ

Category: IC Chips

Specifications
SKU
12591040
Details

BUY ISL95829AHRTZ https://www.utsource.net/itm/p/12591040.html

Parameter Symbol Min Typ Max Unit
Input Voltage VIN 2.7 - 5.5 V
Output Voltage VOUT 0.6 - 3.3 V
Output Current IOUT - 1.5 3.0 A
Efficiency (Typical) η - 94 - %
Switching Frequency fSW - 2.1 - MHz
Quiescent Current IQ - 10 - μA
Shutdown Current ISD - 0.1 - μA
Operating Temperature TOPR -40 - 85 °C
Storage Temperature TSTG -40 - 125 °C

Instructions for Using ISL95829AHRTZ

  1. Input Voltage:

    • Ensure the input voltage is within the range of 2.7V to 5.5V.
    • Use appropriate input capacitors to stabilize the input voltage.
  2. Output Voltage:

    • Set the output voltage using external resistors according to the datasheet formula.
    • Use a low-ESR output capacitor to filter the output voltage.
  3. Output Current:

    • The device can deliver up to 3.0A continuously. Ensure proper heat dissipation if operating at high current levels.
    • Monitor the temperature of the device to avoid overheating.
  4. Efficiency:

    • The typical efficiency is 94%. Optimize the design by selecting low-loss components and minimizing PCB trace lengths.
  5. Switching Frequency:

    • The switching frequency is fixed at 2.1MHz. This helps in reducing the size of external components like inductors and capacitors.
  6. Quiescent Current:

    • The quiescent current is typically 10μA. This low current consumption makes the device suitable for battery-powered applications.
  7. Shutdown Current:

    • When the shutdown pin is activated, the device draws only 0.1μA of current, which is ideal for power-saving modes.
  8. Operating Temperature:

    • The device operates reliably from -40°C to 85°C. Ensure adequate cooling if operating in high-temperature environments.
  9. Storage Temperature:

    • Store the device between -40°C and 125°C to maintain its performance and reliability.
  10. PCB Layout:

    • Follow good PCB layout practices to minimize noise and ensure stable operation. Keep power and ground planes as wide as possible and use short, direct traces for critical signals.
  11. Thermal Management:

    • If operating at high currents, consider adding a heatsink or using a larger PCB area for heat dissipation.
  12. Protection Features:

    • The device includes overcurrent, overvoltage, and thermal protection. Ensure these features are not triggered under normal operating conditions to avoid unexpected shutdowns.

By following these instructions, you can ensure optimal performance and reliability of the ISL95829AHRTZ in your application.

(For reference only)

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