HCPL-7560

HCPL-7560

Category: IC Chips

Specifications
SKU
12591189
Details

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Parameter Symbol Min Typ Max Unit Description
Input Current (Forward) IF - 12 30 mA Forward current through the input LED.
Input Voltage (Forward) VF 1.1 1.3 1.6 V Forward voltage across the input LED.
Isolation Voltage VISOL - - 5000 Vrms Maximum isolation voltage between input and output.
Output Current (Max) IOUT - - 20 mA Maximum continuous output current.
Output Voltage (Max) VOUT - - 30 V Maximum output voltage.
Propagation Delay Time tPLH 1 4 8 μs Time delay from input to output for low-to-high transition.
Propagation Delay Time tPHL 1 4 8 μs Time delay from input to output for high-to-low transition.
Storage Temperature TSTG -40 - 125 °C Temperature range for storage and non-operating conditions.
Operating Temperature TOPR -40 - 105 °C Temperature range for operating conditions.
Power Dissipation PD - - 150 mW Maximum power dissipation at the output.
Common Mode Transient Immunity (CMTI) CMTI -25 - 25 kV/μs Ability to withstand fast voltage transients on the input/output lines.

Instructions:

  1. Power Supply:

    • Ensure the power supply voltage is within the specified range (0 to 30V).
    • The output current should not exceed 20mA to avoid damage.
  2. Input Signal:

    • Apply a forward current of 12 to 30mA to the input LED.
    • The forward voltage drop across the LED is typically 1.3V.
  3. Isolation:

    • The device provides electrical isolation up to 5000Vrms. Ensure that the input and output circuits are properly isolated to prevent any potential hazards.
  4. Temperature Considerations:

    • The operating temperature range is -40°C to 105°C. Ensure the device operates within this range to avoid thermal stress.
    • The storage temperature range is -40°C to 125°C.
  5. Propagation Delay:

    • The propagation delay time for both low-to-high and high-to-low transitions is between 1 and 8 microseconds. This should be considered in timing-critical applications.
  6. Power Dissipation:

    • The maximum power dissipation is 150mW. Ensure adequate heat sinking if the device is expected to dissipate significant power.
  7. Common Mode Transient Immunity (CMTI):

    • The device can handle common mode transients of up to ±25kV/μs. This is important in noisy environments where rapid voltage changes may occur.
  8. Handling and Installation:

    • Handle the device with care to avoid static discharge and mechanical damage.
    • Follow proper soldering techniques and ensure the device is securely mounted to the PCB.
  9. Testing:

    • Before final assembly, test the device under typical operating conditions to ensure it meets the required specifications.
(For reference only)

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