Details

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BUY MB3771PF-G-BND-JNE1 https://www.utsource.net/itm/p/12591250.html

Parameter	Description	Value
Part Number	Device Identifier	MB3771PF-G-BND-JNE1
Type	Device Type	MOSFET
Package	Package Type	TO-252 (DPAK)
Polarity	Polarity of the MOSFET	N-Channel
VDS (Max)	Drain-to-Source Voltage	60V
VGS (Max)	Gate-to-Source Voltage	±20V
ID (Max)	Continuous Drain Current at 25°C	10A
RDS(on)	On-State Resistance at VGS = 10V	18mΩ
Power Dissipation	Maximum Power Dissipation at 25°C	60W
Operating Temperature	Junction Temperature Range	-55°C to +150°C
Storage Temperature	Storage Temperature Range	-65°C to +150°C
Gate Charge	Total Gate Charge	49nC
Input Capacitance	Input Capacitance at VDS = 10V	1120pF
Output Capacitance	Output Capacitance at VDS = 10V	145pF
Reverse Transfer	Reverse Transfer Capacitance at VDS = 10V	55pF
Thermal Resistance	Junction-to-Ambient Thermal Resistance	62°C/W
Junction-to-Case	Junction-to-Case Thermal Resistance	3.5°C/W

Instructions for Use:

1. Handling Precautions:

   • Handle the device with care to avoid damage to the leads and the body.
   • Use appropriate ESD protection measures to prevent damage from static electricity.

2. Mounting:

   • Ensure proper alignment of the device on the PCB.
   • Apply sufficient solder to ensure good electrical and thermal connections.
   • Avoid excessive heat during soldering to prevent damage to the device.

3. Operational Considerations:

   • Ensure that the operating conditions do not exceed the maximum ratings provided.
   • Use a heatsink if necessary to manage the power dissipation and maintain the junction temperature within the specified range.
   • Check the gate drive circuit to ensure it can provide the required gate voltage and current.

4. Testing:

   • Test the device under controlled conditions to verify its performance.
   • Use a multimeter or other appropriate testing equipment to check for continuity and resistance values.

5. Storage:

   • Store the device in a dry, cool place away from direct sunlight.
   • Keep the device in its original packaging until ready for use to protect against moisture and physical damage.

6. Disposal:

   • Follow local regulations for the disposal of electronic components.
   • Recycle the device if possible to minimize environmental impact.

(For reference only)