MT49H16M36BM-25IT

MT49H16M36BM-25IT


Specifications
Details

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Parameter Description
Device Name MT49H16M36BM-25IT
Type SDRAM (Synchronous Dynamic Random Access Memory)
Density 16M x 36 bit
Organization 8-bank, 4M x 36
Voltage Supply (Vcc) 2.5V
Voltage Supply (Vccq) 2.5V
CAS Latency CL=2
Operating Temperature Commercial: 0°C to 70°C
Package Type FBGA (Fine-Pitch Ball Grid Array)
Access Time (tAC) 2.5 ns
Cycle Time (tRC) 45 ns
Refresh Cycle Time 64ms
Data Width 36 bits
Burst Length 2, 4, or full page
Command Input Voltage Vcc ± 0.2V
Output Voltage Swing SSTL_2 (1.2V)
Termination SSTL_2 (1.2V)

Instructions for Use

  1. Power Supply Setup:

    • Ensure that the power supply voltages Vcc and Vccq are set to 2.5V.
    • Provide stable power to avoid voltage fluctuations.
  2. Signal Integrity:

    • Use proper termination resistors for signal lines to prevent reflection issues.
    • Maintain controlled impedance on all high-speed signal lines.
  3. Initialization:

    • Before any read/write operations, initialize the device by issuing a PRECHARGE ALL command followed by an AUTO REFRESH command multiple times as specified in the datasheet.
    • Set the Mode Register according to the desired operating parameters.
  4. Memory Operations:

    • Perform memory accesses using the provided command set, ensuring correct timing parameters such as tAC and tRC are adhered to.
    • Use burst lengths of 2, 4, or full page as required by your application.
  5. Refresh Management:

    • Implement refresh cycles every 64 milliseconds to maintain data integrity.
    • Consider using auto-refresh commands if supported by your controller.
  6. Error Handling:

    • Monitor for potential errors during memory access and implement retry mechanisms if necessary.
    • Ensure that error detection and correction protocols are in place if critical data is being handled.
  7. Thermal Management:

    • Keep the operating temperature within the commercial range of 0°C to 70°C.
    • Provide adequate cooling solutions if the device is expected to operate at higher temperatures.

For detailed specifications and further instructions, refer to the official datasheet provided by the manufacturer.

(For reference only)

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