SNJ54HCT244J

SNJ54HCT244J


Specifications
SKU
12591371
Details

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Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC Operating 4.5 - 5.5 V
Input Voltage VI Input Low 0 - 0.8 V
VI Input High 2.0 - VCC V
Output Voltage (High) VOH IO = -400 μA 2.4 - VCC - 0.1 V
Output Voltage (Low) VOL IO = 16 mA 0 - 0.4 V
Input Leakage Current IIL VI = 0 V -1 - 1 μA
IIL VI = VCC -1 - 1 μA
Output Leakage Current IOL VO = 0 V -1 - 1 μA
IOL VO = VCC -1 - 1 μA
Propagation Delay Time tpd VCC = 5 V, VI = 2.5 V to 0.8 V or 2.0 V - 12 - ns
Power Dissipation PD Continuous - - 150 mW
Operating Temperature Range TA Commercial 0 - 70 °C
TA Industrial -40 - 85 °C

Instructions for Use:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 4.5 V to 5.5 V.
    • Do not exceed the maximum supply voltage to avoid damaging the device.
  2. Input Voltage (VI):

    • For a valid low input, the voltage should be between 0 V and 0.8 V.
    • For a valid high input, the voltage should be between 2.0 V and VCC.
  3. Output Voltage:

    • When the output is high (VOH), it should be at least 2.4 V and can go up to VCC - 0.1 V.
    • When the output is low (VOL), it should be no more than 0.4 V.
  4. Leakage Current:

    • Ensure that the input and output leakage currents do not exceed ±1 μA to maintain proper operation.
  5. Propagation Delay Time (tpd):

    • The propagation delay time is typically 12 ns under standard conditions (VCC = 5 V, VI = 2.5 V to 0.8 V or 2.0 V).
  6. Power Dissipation (PD):

    • The maximum power dissipation is 150 mW. Ensure adequate heat dissipation to prevent overheating.
  7. Operating Temperature:

    • For commercial use, the operating temperature range is 0°C to 70°C.
    • For industrial use, the operating temperature range is -40°C to 85°C.
  8. Handling:

    • Handle the device with care to avoid static damage.
    • Follow proper ESD (Electrostatic Discharge) precautions when handling the device.
  9. Mounting:

    • Ensure proper mounting and soldering techniques to avoid mechanical stress on the device.
    • Use a suitable PCB layout to minimize noise and interference.
  10. Storage:

    • Store the device in a dry, cool place to prevent moisture damage.
    • Follow recommended storage conditions to ensure long-term reliability.
(For reference only)

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