Details

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BUY MXA6500MP https://www.utsource.net/itm/p/12591380.html

Parameter	Description	Value/Range
Part Number	Full part number of the device	MXA6500MP
Function	Type of device	RF Switch
Frequency Range	Operating frequency range	50 MHz to 4 GHz
Insertion Loss	Signal loss through the switch at the specified frequency	1.2 dB (typical)
Isolation	Degree of signal separation between ports	40 dB (typical)
VSWR	Voltage Standing Wave Ratio, measure of impedance matching	1.5:1 (typical)
Power Handling	Maximum power the switch can handle without damage	30 dBm (1 W)
Control Voltage	Voltage required to control the switch state	0 V (OFF), 5 V (ON)
Supply Voltage	Voltage required to power the device	5 V
Quiescent Current	Current drawn by the device when powered but not switching	1 mA (typical)
Switching Time	Time required to change the state of the switch	100 ns (typical)
Operating Temperature	Range of temperatures in which the device can operate reliably	-40°C to +85°C
Storage Temperature	Range of temperatures in which the device can be stored	-55°C to +125°C
Package Type	Physical package of the device	QFN-16
Pin Count	Number of pins on the package	16
Dimensions	Size of the package	5 mm x 5 mm x 0.85 mm
RoHS Compliance	Compliance with Restriction of Hazardous Substances directive	Yes

Instructions for Use

1. Power Supply:

   • Connect the supply voltage (5 V) to the VCC pin.
   • Ensure the ground (GND) is connected to the appropriate ground reference.

2. Control Signals:

   • Apply 0 V to the control pin to turn the switch OFF.
   • Apply 5 V to the control pin to turn the switch ON.

3. Signal Connections:

   • Connect the input signal to the RF IN pin.
   • Connect the output signal to the RF OUT pin.

4. Operating Environment:

   • Ensure the operating temperature is within the specified range (-40°C to +85°C).
   • Store the device in a temperature-controlled environment within the storage temperature range (-55°C to +125°C).

5. Handling Precautions:

   • Handle the device with care to avoid static discharge.
   • Use proper ESD protection measures when handling the device.

6. Testing:

   • Verify the insertion loss and isolation using a network analyzer.
   • Measure the switching time using a high-speed oscilloscope.

7. Mounting:

   • Solder the device onto the PCB following the recommended soldering profile.
   • Ensure good thermal management to maintain performance and reliability.

For detailed application notes and further information, refer to the datasheet provided by the manufacturer.

(For reference only)