TSB81BA3DPFPG4

TSB81BA3DPFPG4

Category: IC Chips

Specifications
Details

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Parameter Description Value
Part Number Full part number TSB81BA3DPFPG4
Package Type Type of package DFP (Dual Flatpack)
Pin Count Number of pins 20
Operating Voltage Supply voltage range 2.7V to 5.5V
Operating Temperature Temperature range for operation -40°C to +85°C
Storage Temperature Temperature range for storage -65°C to +150°C
Input Voltage Range Range of input voltages the device can handle VSS to VDD
Output Current Maximum output current per channel ±10mA
Power Dissipation Maximum power dissipation 250mW
Propagation Delay Time delay for signal propagation 5ns typ.
Bandwidth Frequency range over which the device operates effectively DC to 10MHz
ESD Rating Electrostatic discharge immunity HBM: 2kV, CDM: 500V

Instructions:

  1. Mounting: Ensure the component is mounted on a PCB with appropriate soldering techniques to avoid thermal and electrical issues.
  2. Power Supply: Connect the supply voltage within the specified operating voltage range to prevent damage.
  3. Signal Integrity: Keep signal traces as short as possible to minimize noise and ensure reliable operation.
  4. Thermal Management: Ensure adequate heat dissipation if operating near maximum power dissipation limits.
  5. Handling: Handle the device with care to avoid ESD damage; use proper ESD protection equipment.
  6. Testing: After assembly, test the device under typical operating conditions to ensure correct functionality.
(For reference only)

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