Details

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BUY TA78M12F https://www.utsource.net/itm/p/12592037.html

Parameter	Symbol	Min	Typ	Max	Unit
Input Voltage	VIN	5.0	-	40	V
Output Voltage	VOUT	-	12	-	V
Output Current	IOUT	-	1.0	1.5	A
Quiescent Current	IQ	-	10	30	mA
Dropout Voltage	VD	-	1.0	-	V
Thermal Shutdown	TSD	-	150	-	掳C
Operating Temperature	TOPR	-40	-	85	掳C
Storage Temperature	TSTG	-65	-	150	掳C

Instructions for Use:

1. Input Voltage (VIN):

   • Ensure the input voltage is within the range of 5V to 40V. The regulator will not function correctly outside this range.

2. Output Voltage (VOUT):

   • The output voltage is fixed at 12V. No external components are required to set this voltage.

3. Output Current (IOUT):

   • The maximum continuous output current is 1.5A, but it is typically rated for 1.0A to ensure reliable operation and prevent overheating.

4. Quiescent Current (IQ):

   • The quiescent current is the current consumed by the regulator when no load is applied. It typically ranges from 10mA to 30mA.

5. Dropout Voltage (VD):

   • The dropout voltage is the minimum difference between the input and output voltages required for the regulator to maintain regulation. It is typically around 1.0V.

6. Thermal Shutdown (TSD):

   • The regulator includes thermal protection that will shut down the device if the temperature exceeds 150掳C to prevent damage.

7. Operating Temperature (TOPR):

   • The operating temperature range is from -40掳C to 85掳C. Ensure the device operates within this range to avoid performance issues.

8. Storage Temperature (TSTG):

   • The storage temperature range is from -65掳C to 150掳C. Store the device in this range to prevent damage.

9. Mounting:

   • Mount the regulator on a heatsink if it will be operating at high output currents or in high ambient temperatures to improve heat dissipation.

10. Capacitors:

    • Use input and output capacitors as recommended by the manufacturer to stabilize the regulator and filter out noise. Typically, a 10渭F electrolytic capacitor on the input and a 10渭F electrolytic capacitor on the output are sufficient.

11. PCB Layout:

    • Ensure proper PCB layout with short leads and wide traces to minimize voltage drops and improve efficiency.

12. Handling:

    • Handle the device with care to avoid static discharge and physical damage. Use appropriate ESD protection measures.

(For reference only)