Details
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| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Supply Voltage | VDD | 1.7 | - | 5.5 | V | |
| Output Current (High) | IOH | - | 20 | 40 | mA | VDD = 5V, VOUT = 2.5V |
| Output Current (Low) | IOL | 20 | 40 | 60 | mA | VDD = 5V, VIN = 2.5V |
| Input Leakage Current | IIK | -1 | - | 1 | 渭A | VDD = 5V |
| Propagation Delay Time | tpd | - | 8 | - | ns | VDD = 5V, VIL = 0.8V, VIH = 2.0V |
| Power Dissipation | PD | - | - | 150 | mW | Continuous, per output |
| Operating Temperature | Toper | -40 | - | 85 | 掳C | |
| Storage Temperature | Tstg | -65 | - | 150 | 掳C |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (VDD) is within the range of 1.7V to 5.5V.
- Connect the power supply to the VDD pin and ground to the GND pin.
Output Configuration:
- The device can source or sink current up to 40mA per output.
- For high output (IOH), ensure the load does not exceed 40mA.
- For low output (IOL), ensure the load can handle up to 60mA.
Input Handling:
- Minimize input leakage current by keeping it below 1渭A.
- Ensure input signals are within the valid logic levels (VIL and VIH).
Timing Considerations:
- The propagation delay time (tpd) is typically 8ns at VDD = 5V.
- Account for this delay in your timing calculations.
Thermal Management:
- The maximum power dissipation per output is 150mW.
- Ensure adequate heat dissipation if operating near the maximum power limit.
Temperature Range:
- The device operates reliably between -40掳C and 85掳C.
- Store the device between -65掳C and 150掳C.
Handling Precautions:
- Handle the device with care to avoid static discharge.
- Follow standard ESD protection guidelines.
Mounting:
- Ensure proper soldering and mounting to maintain electrical and mechanical integrity.
- Follow the recommended PCB layout guidelines for optimal performance.
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