D25XB80

D25XB80


Specifications
SKU
12593253
Details

BUY D25XB80 https://www.utsource.net/itm/p/12593253.html

Parameter Symbol Min Typ Max Unit Notes
Breakdown Voltage VBR - 80 - V
Maximum Repetitive Peak Reverse Voltage VRM - 80 - V
Average Rectified Output Current (Tc=100掳C) IO 25 - - A
Peak Surge Current (Non-repetitive) IFSM - 400 - A t = 8.3 ms, sin half wave
Forward Voltage at Rated Current VF - 1.1 - V IF = 25 A
Reverse Current at 25掳C IR - 10 - 渭A VR = 80 V
Junction Temperature Tj -40 - 150 掳C
Storage Temperature Tstg -65 - 150 掳C
Operating Temperature Range Topr -40 - 100 掳C

Instructions for Use:

  1. Mounting:

    • Ensure proper heat sinking to maintain the junction temperature within the specified range.
    • Use appropriate mounting hardware to secure the device.
  2. Electrical Connections:

    • Connect the anode and cathode terminals correctly to avoid reverse polarity, which can lead to device failure.
    • Use heavy gauge wires or bus bars to handle the high current ratings.
  3. Thermal Management:

    • The device should be mounted on a heatsink with adequate thermal conductivity to dissipate heat effectively.
    • Ensure that the thermal resistance between the junction and the heatsink is minimized.
  4. Surge Handling:

    • The device can handle peak surge currents up to 400 A for a short duration (8.3 ms, sin half wave). Ensure that any surge conditions do not exceed this limit.
  5. Storage and Handling:

    • Store the device in a dry, cool place away from direct sunlight.
    • Handle with care to avoid mechanical damage to the leads and body.
  6. Testing:

    • Before installation, test the device using a suitable tester to ensure it meets the specified parameters.
    • Avoid testing under conditions that exceed the maximum ratings.
  7. Environmental Considerations:

    • The device is designed to operate within the specified temperature ranges. Exceeding these limits can result in reduced performance or failure.
    • Ensure that the operating environment is free from corrosive gases and excessive humidity.
  8. Compliance:

    • Verify that the device complies with all relevant safety and regulatory standards for your application.
(For reference only)

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