NGTB25N120FL3WG

NGTB25N120FL3WG


Specifications
Details

BUY NGTB25N120FL3WG https://www.utsource.net/itm/p/12593278.html

Parameter Description Value Unit
Device Type N-channel MOSFET - -
Package D2PAK (TO-263) - -
Drain-Source Voltage Maximum drain-source voltage 1200 V
Continuous Drain Current Continuous drain current at Tc = 25掳C 25 A
Pulse Drain Current Pulse drain current (t = 10 渭s, Duty cycle = 1%) 78 A
Gate-Source Voltage Maximum gate-source voltage 卤20 V
Total Power Dissipation Total power dissipation (Tc = 25掳C) 204 W
Junction Temperature Operating junction temperature range -55 to +175 掳C
Thermal Resistance Junction-to-case thermal resistance 0.5 掳C/W
Input Capacitance Input capacitance at VGS = 0 V, VDS = 10 V 2900 pF
Output Capacitance Output capacitance at VGS = 0 V, VDS = 10 V 125 pF
Reverse Transfer Capacitance Reverse transfer capacitance at VGS = 0 V, VDS = 10 V 115 pF
RDS(on) On-state resistance at VGS = 10 V, ID = 10 A 0.076

Instructions for Use:

  1. Handling Precautions:

    • Ensure proper ESD protection when handling the device.
    • Avoid exceeding the maximum ratings listed in the parameter table.
  2. Mounting:

    • Follow recommended PCB layout guidelines for optimal thermal performance.
    • Ensure good heat sinking to maintain junction temperature within limits.
  3. Biasing and Operation:

    • Apply gate-source voltage within specified limits to avoid damage.
    • Monitor drain current to prevent exceeding continuous or pulse current ratings.
  4. Storage:

    • Store in a dry, cool place away from direct sunlight.
    • Keep in original packaging until ready to use to prevent physical damage.
  5. Testing:

    • Use appropriate test equipment and methods to verify device parameters.
    • Refer to datasheet for detailed testing procedures and conditions.
(For reference only)

View more about NGTB25N120FL3WG on main site