Details

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BUY LM2586S-ADJ/NOPB https://www.utsource.net/itm/p/12593520.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Input Voltage	VIN	Continuous	3.0	-	40	V
Output Voltage Range	VOUT	Adjustable	1.23	-	37	V
Switching Frequency	fSW	Fixed	-	52	-	kHz
Quiescent Current	IQ	CV, VOUT = 5V	-	5	-	mA
Shutdown Current	ISD	VSHDN < 0.4V	-	60	-	μA
Load Regulation	ΔVOUT	IOUT = 0 to ILIM	-	0.5	-	%
Line Regulation	ΔVOUT	VIN = 5 to 35V	-	0.01	-	%/V
Efficiency	η	VIN = 12V, VOUT = 5V, IOUT = 1A	-	84	-	%
Output Ripple Voltage	VRIPPLE	COUT = 100μF, VIN = 12V, VOUT = 5V	-	50	-	mVpp

Instructions for LM2586S-ADJ/NOPB

1. Input Voltage (VIN):

   • Connect the input voltage between 3V and 40V to the VIN pin. Ensure that the input capacitor is placed close to the VIN pin to reduce noise.

2. Output Voltage Adjustment:

   • Use an external resistor network connected to the FB (feedback) pin to set the output voltage within the range of 1.23V to 37V. The formula to calculate the resistors is VOUT = 1.23V * (1 + R2/R1).

3. Switching Frequency:

   • The switching frequency is fixed at 52kHz. This parameter is not adjustable.

4. Quiescent Current:

   • Monitor the quiescent current which typically stays around 5mA under continuous voltage regulation.

5. Shutdown Functionality:

   • Apply a low signal (<0.4V) to the SHDN pin to put the device into shutdown mode, reducing the current draw to approximately 60μA.

6. Load and Line Regulation:

   • Ensure load and line regulations are within acceptable limits as specified in the table. Adjust external components if necessary.

7. Efficiency Considerations:

   • For optimal efficiency, match the input and output conditions as closely as possible to those listed in the efficiency section.

8. Output Ripple:

   • Keep the output ripple within acceptable limits by using appropriate output capacitance values. A typical value is 100μF.

9. Thermal Considerations:

   • Ensure adequate heat dissipation to maintain reliable operation, especially under high load conditions.

10. Layout Recommendations:

    • Place all components close to the IC to minimize parasitic effects and improve performance. Use wide traces for ground and power connections to reduce resistance and inductance.

(For reference only)