Details

---

BUY FX604D4 https://www.utsource.net/itm/p/12593606.html

Parameter	Description	Value
Part Number	Full part number of the device	FX604D4
Type	Type of the device	MOSFET Driver
Package	Package type	SOIC-8
Supply Voltage	Operating voltage range	4.5V to 18V
Input Voltage	Maximum input voltage	20V
Output Current	Continuous output current	±1.5A
Peak Output Current	Peak output current (non-repetitive)	±3A
Propagation Delay	Time delay from input to output	50ns
Operating Temperature	Operating temperature range	-40°C to 125°C
Storage Temperature	Storage temperature range	-65°C to 150°C
Power Dissipation	Maximum power dissipation	750mW
Isolation Voltage	Isolation voltage between input and output	2500Vrms
Protection Features	Built-in protection features	Overcurrent, Thermal Shutdown, UVLO

Instructions for Use:

1. Power Supply Connection:

   • Connect the supply voltage (Vcc) to the appropriate pin.
   • Ensure the supply voltage is within the specified range (4.5V to 18V).

2. Input Signal:

   • Apply the control signal to the input pin.
   • The input voltage should not exceed 20V.

3. Output Configuration:

   • Connect the load to the output pins.
   • Ensure the continuous output current does not exceed ±1.5A and the peak current does not exceed ±3A.

4. Thermal Management:

   • Ensure adequate heat sinking if operating at high currents or temperatures.
   • Monitor the device temperature to avoid exceeding the maximum operating temperature of 125°C.

5. Protection:

   • The device includes overcurrent, thermal shutdown, and under-voltage lockout (UVLO) protection.
   • Do not rely solely on these protections; design the system to minimize risk.

6. Storage:

   • Store the device in a dry environment within the temperature range of -65°C to 150°C.

7. Handling:

   • Handle with care to avoid damage to the leads and package.
   • Follow ESD (Electrostatic Discharge) precautions to prevent damage to the device.

8. Testing:

   • Perform initial testing at room temperature with a known good setup.
   • Gradually increase the load and environmental conditions to ensure reliable operation.

9. Mounting:

   • Solder the device to the PCB using standard reflow soldering techniques.
   • Ensure proper alignment and soldering to avoid shorts and poor connections.

(For reference only)