Details
BUY MC74VHC1G09DTT1 https://www.utsource.net/itm/p/12594284.html
Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
---|---|---|---|---|---|---|
Supply Voltage | VCC | 2.0 | - | 6.0 | V | |
Input Low Voltage | VIL | - | 0.8 | - | V | VCC = 4.5V to 5.5V |
Input High Voltage | VIH | - | 2.0 | - | V | VCC = 4.5V to 5.5V |
Output Low Voltage | VOL | 0.0 | 0.1 | 0.4 | V | IOL = 4 mA |
Output High Voltage | VOH | 2.4 | 2.7 | VCC | V | IOH = -4 mA |
Propagation Delay Time | tpd | 4.0 | - | 7.0 | ns | VCC = 4.5V to 5.5V, TA = 25°C |
Power Dissipation | PD | - | - | 100 | mW | Continuous |
Operating Temperature | TA | -40 | - | 85 | °C | |
Storage Temperature | TSTG | -65 | - | 150 | °C |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (VCC) is within the range of 2.0V to 6.0V.
- Connect the ground (GND) pin to a stable reference point.
Input Signals:
- For a logic low input, ensure the voltage is below 0.8V when VCC is between 4.5V and 5.5V.
- For a logic high input, ensure the voltage is above 2.0V when VCC is between 4.5V and 5.5V.
Output Signals:
- When the output is low, the voltage will be between 0.0V and 0.4V with a sink current of 4 mA.
- When the output is high, the voltage will be between 2.4V and VCC with a source current of -4 mA.
Propagation Delay:
- The propagation delay time (tpd) should be considered when designing circuits to ensure proper timing.
Temperature Considerations:
- The device is designed to operate within the temperature range of -40°C to 85°C.
- Store the device in environments where the temperature does not exceed -65°C to 150°C.
Power Dissipation:
- Ensure that the power dissipation (PD) does not exceed 100 mW to avoid overheating and potential damage.
Handling:
- Handle the device with care to avoid static discharge, which can damage the internal components.
- Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.
Mounting:
- Ensure proper mounting to maintain mechanical stability and thermal performance.
- Use recommended soldering profiles to avoid thermal stress on the device.
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