Details

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BUY RD9570 PS17 https://www.utsource.net/itm/p/12594285.html

Parameter	Description	Value
Part Number	Part number of the device	RD9570 PS17
Type	Type of device	MOSFET
Package	Package type	TO-220
VDS (Max)	Maximum Drain-to-Source Voltage	70V
VGS (Max)	Maximum Gate-to-Source Voltage	卤20V
ID (Max)	Maximum Drain Current (at VGS = 10V, Ta = 25掳C)	40A
RDS(on) (Max)	On-State Resistance (at VGS = 10V, ID = 20A)	4.5m惟
Power Dissipation (Max)	Maximum Power Dissipation (at Ta = 25掳C)	150W
Operating Temperature Range	Operating Temperature Range (TJ)	-55掳C to 150掳C
Storage Temperature Range	Storage Temperature Range	-65掳C to 150掳C
Gate Charge (Qg)	Total Gate Charge (at VGS = 10V, ID = 20A)	130nC
Input Capacitance (Ciss)	Input Capacitance (at VDS = 25V, f = 1MHz)	1800pF
Output Capacitance (Coss)	Output Capacitance (at VDS = 25V, f = 1MHz)	450pF
Reverse Transfer Capacitance (Crss)	Reverse Transfer Capacitance (at VDS = 25V, f = 1MHz)	350pF
Thermal Resistance (R胃JC)	Junction-to-Case Thermal Resistance	0.5掳C/W
Thermal Resistance (R胃JA)	Junction-to-Ambient Thermal Resistance	62.5掳C/W

Instructions for Use

1. Handling Precautions:

   • Handle the device with care to avoid mechanical damage.
   • Use proper ESD (Electrostatic Discharge) protection when handling the device to prevent damage to the gate oxide.

2. Mounting:

   • Ensure that the mounting surface is clean and flat.
   • Use a suitable heat sink to manage thermal dissipation, especially for high-power applications.
   • Apply a thin layer of thermal compound between the device and the heat sink to improve thermal conductivity.

3. Biasing:

   • Apply the gate voltage (VGS) carefully to avoid exceeding the maximum ratings.
   • Use a gate resistor to limit the gate current and prevent oscillations.

4. Operation:

   • Operate the device within the specified temperature range to ensure reliable performance.
   • Monitor the junction temperature to prevent overheating, which can lead to device failure.

5. Testing:

   • Use a curve tracer or an equivalent test setup to verify the device parameters.
   • Perform tests at the specified conditions to ensure accurate measurements.

6. Storage:

   • Store the device in a dry, cool place away from direct sunlight.
   • Avoid exposing the device to extreme temperatures or humidity to prevent degradation.

7. Soldering:

   • Use a controlled soldering process to avoid excessive heat, which can damage the device.
   • Follow the recommended soldering profile provided by the manufacturer.

(For reference only)