Details

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BUY FSBB30CH60F/30A600V https://www.utsource.net/itm/p/12594793.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Forward Voltage	VF	-	2.0	-	V	@ IF = 15 A, Tj = 25°C
Reverse Recovery Time	trr	-	80	-	ns	@ IF = 15 A, di/dt = 200 A/μs
Reverse Recovery Charge	Qrr	-	100	-	nC	@ IF = 15 A, di/dt = 200 A/μs
Junction Capacitance	CJ	-	12	-	pF	@ VR = 0 V, f = 1 MHz
Thermal Resistance (J-C)	RθJC	-	1.6	-	°C/W	-
Maximum Forward Current	IF(AV)	-	-	30	A	@ TC = 75°C, Duty Cycle = 100%
Maximum Reverse Voltage	VRSM	-	-	600	V	-
Operating Junction Temp.	TJ	-55	-	175	°C	-

Instructions for Use:

1. Mounting and Handling:

   • Ensure proper heat sinking to maintain junction temperature within specified limits.
   • Handle with care to avoid mechanical damage.

2. Electrical Connections:

   • Ensure all connections are secure and free from corrosion.
   • Use appropriate wire gauges to handle the maximum current ratings.

3. Thermal Management:

   • The thermal resistance (R_θJC) is 1.6°C/W. Design the cooling system to keep the junction temperature below 175°C under all operating conditions.

4. Surge Current Handling:

   • The device can handle surge currents up to 30 A continuously at a case temperature of 75°C. Ensure that the application does not exceed these limits.

5. Reverse Voltage Protection:

   • The maximum reverse voltage (V_RSM) is 600 V. Ensure that the circuit design does not expose the device to voltages exceeding this limit.

6. Operating Temperature Range:

   • The device can operate over a temperature range from -55°C to 175°C. Ensure that the ambient temperature and heat dissipation are managed to keep the junction temperature within this range.

7. Testing and Validation:

   • Before finalizing the design, perform thorough testing under all expected operating conditions to ensure reliability and performance.

8. Storage and Packaging:

   • Store in a dry, cool place away from direct sunlight and corrosive environments.
   • Follow recommended packaging guidelines to prevent damage during transportation and storage.

9. Compliance:

   • Ensure that the device complies with all relevant safety and regulatory standards for the intended application.

(For reference only)