Details

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BUY 7MBP50RA120-55/50A1200V https://www.utsource.net/itm/p/12594864.html

Parameter	Symbol	Min	Typical	Max	Unit
Rated Voltage	VRRM	-	1200	-	V
Rated Current (Continuous)	IT(RMS)	-	50	-	A
Peak Non-Repetitive Forward Current	IFSM	-	550	-	A
Forward Voltage Drop	VF	1.6	-	2.0	V
Reverse Recovery Time	trr	-	80	100	ns
Junction Temperature	TJ	-40	-	150	°C
Storage Temperature	TSTG	-55	-	150	°C
Power Dissipation	PD	-	1500	-	W

Instructions for Use:

1. Mounting and Handling:

   • Ensure that the device is handled with care to avoid mechanical stress.
   • Mount the device on a heatsink to ensure proper heat dissipation, especially under high current conditions.

2. Electrical Connections:

   • Connect the device according to the pinout diagram provided in the datasheet.
   • Use appropriate wire gauges to handle the rated current without excessive resistance.

3. Thermal Management:

   • Ensure that the junction temperature (TJ) does not exceed 150°C.
   • Use thermal paste between the device and the heatsink to improve thermal conductivity.

4. Overvoltage Protection:

   • Implement overvoltage protection circuits to prevent damage from voltage spikes.
   • Consider using snubber circuits to reduce voltage transients during switching.

5. Current Limiting:

   • Ensure that the continuous current does not exceed 50A.
   • For short-term pulses, do not exceed the peak non-repetitive forward current of 550A.

6. Reverse Recovery:

   • Be aware of the reverse recovery time (trr) to avoid excessive power dissipation during switching transitions.
   • Optimize the circuit design to minimize the impact of reverse recovery on overall performance.

7. Storage and Operating Temperature:

   • Store the device in a dry, cool environment within the storage temperature range (-55°C to 150°C).
   • Operate the device within the specified junction temperature range (-40°C to 150°C).

8. Testing and Verification:

   • Test the device under actual operating conditions to ensure it meets the required specifications.
   • Verify the thermal management system to ensure it can handle the expected power dissipation.

9. Compliance and Standards:

   • Ensure that the device complies with relevant safety and regulatory standards for your application.
   • Refer to the datasheet for additional compliance information and certifications.

(For reference only)