Details

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BUY UPD16861GS https://www.utsource.net/itm/p/12594866.html

Parameter	Description	Value	Unit
Supply Voltage (VCC)	Operating supply voltage range	4.5 to 5.5	V
Output Current (IOH)	High-level output current	-20	mA
Output Current (IOL)	Low-level output current	30	mA
Input Voltage (VIH)	High-level input voltage	2.0 to 5.5	V
Input Voltage (VIL)	Low-level input voltage	0 to 0.8	V
Propagation Delay Time (tPD)	Typical propagation delay time	10	ns
Operating Temperature (Toper)	Operating temperature range	-40 to +85	掳C
Storage Temperature (Tstg)	Storage temperature range	-65 to +150	掳C
Maximum Junction Temperature (Tj(max))	Maximum junction temperature	150	掳C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (VCC) is within the specified range of 4.5V to 5.5V.
   • Connect a bypass capacitor (typically 0.1渭F) between VCC and GND as close to the device as possible to filter out noise.

2. Input Signals:

   • High-level input voltage (VIH) should be between 2.0V and 5.5V.
   • Low-level input voltage (VIL) should be between 0V and 0.8V.
   • Ensure input signals are clean and within the specified voltage ranges to avoid damage or incorrect operation.

3. Output Loads:

   • The device can source up to 20mA (IOH) and sink up to 30mA (IOL).
   • When driving loads, ensure the total current does not exceed these limits to prevent damage to the device.

4. Propagation Delay:

   • The typical propagation delay time (tPD) is 10ns. This value can vary slightly depending on operating conditions.
   • Account for this delay in your timing calculations to ensure proper system performance.

5. Temperature Considerations:

   • The operating temperature range (Toper) is from -40掳C to +85掳C.
   • The storage temperature range (Tstg) is from -65掳C to +150掳C.
   • The maximum junction temperature (Tj(max)) is 150掳C. Ensure adequate heat dissipation to keep the device within safe operating limits.

6. Handling and Storage:

   • Handle the device with care to avoid static discharge, which can damage the internal components.
   • Store the device in a dry, cool environment within the specified storage temperature range.

7. Soldering:

   • Use appropriate soldering techniques and temperatures to avoid thermal shock and potential damage to the device.
   • Follow recommended soldering profiles provided by the manufacturer.

8. Testing:

   • Before integrating the device into a larger system, test it individually to ensure it meets all specifications.
   • Use a multimeter to verify supply voltage and output levels.

By following these guidelines, you can ensure reliable and efficient operation of the UPD16861GS.

(For reference only)