Details
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Below is the parameter table and instructions for the 2SK940 MOSFET.
Parameter Table
| Parameter | Symbol | Min | Typ | Max | Unit | Condition |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | - | - | 300 | V | - |
| Gate-Source Voltage | VGS | -15 | - | 15 | V | - |
| Continuous Drain Current | ID | - | 2.5 | 3.5 | A | TC = 25°C |
| Pulse Drain Current | ID(p) | - | 7 | 10 | A | tp = 10 ms, f ≤ 1 Hz |
| Total Dissipation | PT | - | - | 40 | W | TC = 25°C |
| Junction Temperature | TJ | - | - | 150 | °C | - |
| Storage Temperature Range | Tstg | -55 | - | 150 | °C | - |
| Input Capacitance | Ciss | - | 160 | - | pF | VDS = 25V, f = 1 MHz |
| Output Capacitance | Coss | - | 80 | - | pF | VDS = 25V, f = 1 MHz |
| Transfer Conductance | gfs | - | 0.4 | - | S | VDS = 25V, ID = 2.5A |
| Threshold Voltage | VGS(th) | 2 | 3 | 4 | V | ID = 1 mA |
| On-State Resistance | RDS(on) | - | 0.8 | - | Ω | VGS = 10V, ID = 2.5A |
Instructions
Handling Precautions:
- ESD Protection: The 2SK940 is sensitive to electrostatic discharge (ESD). Use proper ESD protection measures, such as wrist straps and grounded work surfaces, when handling the device.
- Temperature Management: Ensure that the junction temperature does not exceed 150°C to avoid thermal damage. Use heat sinks or other cooling methods if necessary.
- Storage Conditions: Store the device in a dry environment within the temperature range of -55°C to 150°C.
Mounting and Soldering:
- Soldering Temperature: Use a soldering iron with a temperature setting between 260°C and 300°C. Do not exceed 300°C to prevent damage to the device.
- Soldering Time: Keep the soldering time to a minimum, ideally less than 10 seconds per connection.
- Mechanical Stress: Avoid applying excessive mechanical stress to the leads during mounting. Use appropriate clamps and supports to ensure the device is securely mounted without causing damage.
Operational Considerations:
- Gate-Source Voltage: Ensure that the gate-source voltage (VGS) remains within the specified range of -15V to +15V to prevent gate oxide breakdown.
- Drain-Source Voltage: The drain-source voltage (VDS) should not exceed 300V to avoid breakdown and potential failure.
- Current Limiting: Implement current limiting circuits to protect the device from exceeding the maximum continuous drain current (ID) of 3.5A and the pulse drain current (ID(p)) of 10A.
Testing and Measurement:
- Threshold Voltage: Measure the threshold voltage (VGS(th)) by applying a small drain current (1 mA) and noting the gate-source voltage at which the device begins to conduct.
- On-State Resistance: Measure the on-state resistance (RDS(on)) by applying a known gate-source voltage (10V) and a known drain current (2.5A), then measuring the voltage drop across the drain and source terminals.
By following these parameters and instructions, you can ensure the reliable operation and longevity of the 2SK940 MOSFET.
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