Details
BUY F85226AF https://www.utsource.net/itm/p/12595003.html
| Parameter | Symbol | Min | Typical | Max | Unit | Notes |
|---|---|---|---|---|---|---|
| Forward Voltage | VF | 1.8 | 2.0 | 2.2 | V | At IF = 20mA |
| Reverse Breakdown Voltage | VR | - | 5 | 7 | V | At IR = 1mA |
| Continuous Forward Current | IF | - | 20 | 30 | mA | At Ta = 25°C |
| Peak Forward Current | IF(surge) | - | 100 | 150 | mA | Pulse width ≤ 1ms, duty cycle ≤ 1/10 |
| Total Dissipation | PT | - | 100 | 150 | mW | At Ta = 25°C |
| Operating Temperature | TA | -40 | - | 85 | °C | |
| Storage Temperature | TSTG | -40 | - | 125 | °C | |
| Wavelength | λd | 620 | 625 | 630 | nm | |
| Viewing Angle | θ1/2 | 10 | 15 | 20 | ° |
Instructions for Use:
Mounting and Handling:
- Handle the device with care to avoid mechanical damage.
- Ensure that the leads are not bent excessively close to the body of the device.
Electrical Connections:
- Connect the anode (A) and cathode (K) leads correctly to avoid reverse polarity which can lead to device failure.
- Use a current-limiting resistor to ensure the forward current does not exceed the maximum rating.
Thermal Management:
- Ensure adequate heat dissipation if operating at high currents or in high ambient temperatures.
- Do not exceed the total power dissipation limit.
Environmental Considerations:
- Store the device in a dry environment to prevent moisture damage.
- Operate within the specified temperature range to ensure reliable performance.
Testing:
- Test the device using the specified test conditions to ensure it meets the performance parameters.
- Avoid prolonged exposure to peak forward current to prevent premature aging.
Soldering:
- Use a soldering iron with a temperature not exceeding 300°C.
- Soldering time should not exceed 5 seconds per connection to avoid thermal damage.
Compliance:
- Ensure compliance with relevant safety and regulatory standards for your application.
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