EPM7128STC100-10N

EPM7128STC100-10N

Category: IC Chips

Specifications
SKU
12595015
Details

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Parameter Description Value
Device Type CPLD (Complex Programmable Logic Device) EPM7128STC100-10N
Package TQFP (Thin Quad Flat Package) 100-pin
Operating Voltage (VCC) Supply Voltage for Logic Core and I/Os 3.3V ± 5%
I/O Banks Number of Input/Output Banks 4
I/O Pins Total Number of I/O Pins 72
Logic Cells Number of Logic Cells 1,280
Macrocells Number of Macrocells 128
Maximum Frequency Maximum Operating Frequency 160 MHz
Configuration Memory Configuration Memory Size 14,336 bits
Configuration Method In-System Programming (ISP) via JTAG or AS (Active Serial) Supported
Temperature Range Operating Temperature Range -40°C to +85°C
Power Consumption Typical Power Consumption (Static) 50 mW (at 3.3V)
Programming Voltage Voltage for Programming 3.3V ± 5%
ESD Protection Electrostatic Discharge Protection HBM: 2000V, MM: 200V
Package Dimensions Width x Length x Height 14 mm x 14 mm x 1.4 mm
Lead Finish Lead Finish Tin-lead (SnPb)
RoHS Compliance Restriction of Hazardous Substances Not RoHS Compliant

Instructions for Use:

  1. Power Supply:

    • Ensure that the VCC supply is within the specified range of 3.3V ± 5%.
    • Connect the GND pins to a stable ground reference.
  2. Configuration:

    • Use the JTAG or AS method for in-system programming.
    • Ensure the configuration data is correctly loaded into the device before operation.
  3. I/O Handling:

    • Do not exceed the maximum ratings for I/O voltages.
    • Use appropriate pull-up or pull-down resistors as needed for I/O lines.
  4. Temperature:

    • Operate the device within the specified temperature range (-40°C to +85°C) to ensure reliable performance.
  5. ESD Protection:

    • Handle the device with care to avoid ESD damage.
    • Use ESD protective equipment and follow standard ESD handling procedures.
  6. Mounting:

    • Ensure proper alignment and soldering of the TQFP package to the PCB.
    • Follow recommended reflow soldering profiles to avoid thermal stress.
  7. Testing:

    • Perform functional testing after programming and mounting to verify correct operation.
  8. Storage:

    • Store the device in a dry, cool place away from direct sunlight and sources of heat.
    • Use anti-static bags for long-term storage to prevent ESD damage.
(For reference only)

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