Details

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BUY HE24C02 https://www.utsource.net/itm/p/12595072.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Memory Capacity			256		bytes	Total memory size
Operating Voltage	VCC	1.8	2.5	5.5	V	Supply voltage range
Operating Current (Read)	ICCR	1	3	5	mA	Current during read operation
Operating Current (Write)	ICCW	1	3	5	mA	Current during write operation
Standby Current	ICCS	0.1	1	2	渭A	Current in standby mode
Write Cycle Time	tWC	5	10	15	ms	Time required to complete a write cycle
Data Retention			10	100	years	Guaranteed data retention time
Operating Temperature	Toper	-40		85	掳C	Range of temperatures for normal operation
Storage Temperature	Tstg	-65		150	掳C	Range of temperatures for storage
Package Type			DIP	SOP		Available package types

Instructions for Using HE24C02

1. Power Supply:

   • Ensure the supply voltage (VCC) is within the specified range (1.8V to 5.5V).
   • Connect the ground (GND) pin to the system ground.

2. Pin Configuration:

   • VCC: Power supply pin.
   • GND: Ground pin.
   • A0-A7: Address lines (8 bits).
   • D0-D7: Data lines (8 bits).
   • WE: Write Enable pin. Active low.
   • OE: Output Enable pin. Active low.
   • CE: Chip Enable pin. Active low.

3. Read Operation:

   • Set the address lines (A0-A7) to the desired memory address.
   • Set CE and OE to low to enable the chip and output.
   • The data at the specified address will appear on the data lines (D0-D7).

4. Write Operation:

   • Set the address lines (A0-A7) to the desired memory address.
   • Set the data lines (D0-D7) to the data you want to write.
   • Set CE and WE to low to enable the chip and initiate the write operation.
   • Wait for the write cycle time (tWC) to complete before performing another operation.

5. Standby Mode:

   • Set CE to high to put the device in standby mode, reducing power consumption.

6. Data Retention:

   • Data stored in the HE24C02 will be retained for up to 100 years under normal operating conditions.

7. Temperature Considerations:

   • Ensure the operating temperature is within the specified range (-40掳C to 85掳C) for reliable performance.
   • Store the device within the storage temperature range (-65掳C to 150掳C) to avoid damage.

8. Package Handling:

   • Handle the device with care to avoid static discharge and physical damage.
   • Follow the recommended soldering and handling procedures for the selected package type (DIP or SOP).

(For reference only)