Details

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BUY XR68C681CJTR-F https://www.utsource.net/itm/p/12596254.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	Vcc	Operating Range	2.7	-	5.5	V
Operating Temperature	Toper		-40	-	85	°C
Storage Temperature	Tstg		-65	-	150	°C
Input Voltage Range	Vin		0	-	Vcc	V
Output Current	Iout	Per Channel	-	25	35	mA
Power Dissipation	Pdiss	Maximum	-	-	625	mW
Rise Time	tr	Typical	-	10	-	ns
Fall Time	tf	Typical	-	10	-	ns
Propagation Delay	tpd	Typical	-	10	-	ns
Quiescent Current	Iq		-	10	20	μA

Instructions for XR68C681CJTR-F

1. Supply Voltage (Vcc):

   • Ensure the supply voltage is within the operating range of 2.7V to 5.5V. Exceeding these limits can damage the device.

2. Operating Temperature (Toper):

   • The device operates reliably between -40°C and 85°C. Avoid operating outside this range to prevent performance degradation or failure.

3. Storage Temperature (Tstg):

   • Store the device in an environment where the temperature ranges from -65°C to 150°C to ensure long-term reliability.

4. Input Voltage Range (Vin):

   • The input voltage should not exceed the supply voltage (Vcc) to avoid damage to the device.

5. Output Current (Iout):

   • Each channel can provide up to 35mA of output current, with a typical value of 25mA. Do not exceed the maximum output current to prevent overheating and potential damage.

6. Power Dissipation (Pdiss):

   • The maximum power dissipation is 625mW. Ensure adequate heat sinking or cooling if the device is expected to dissipate significant power.

7. Rise and Fall Time (tr, tf):

   • The typical rise and fall times are 10ns each. These values help in designing the timing requirements of the circuit.

8. Propagation Delay (tpd):

   • The typical propagation delay is 10ns. This is important for timing considerations in high-speed applications.

9. Quiescent Current (Iq):

   • The quiescent current is typically 10μA and can go up to 20μA. This is the current consumed by the device when it is not driving any load.

10. Handling Precautions:

    • Handle the device with care to avoid static discharge. Use proper ESD protection measures.
    • Follow the recommended PCB layout guidelines to ensure optimal performance and reliability.
    • Ensure all connections are secure and free from shorts or open circuits.

11. Application Notes:

    • Refer to the datasheet and application notes for detailed information on specific applications and advanced usage scenarios.

(For reference only)