Details

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BUY M27C4002-80XF1 https://www.utsource.net/itm/p/12596377.html

Parameter	Description	Value
Device Type	Non-Volatile Memory	512K x 8 UV Erasable PROM
Package	Plastic DIP, PLCC, TSSOP	-
Operating Voltage (Vcc)	Supply Voltage Range	4.5V to 5.5V
Standby Current (Typical)	Power Consumption in Standby Mode	50 μA at Vcc = 5V, Ta = 25°C
Active Current (Typical)	Power Consumption in Active Mode	15 mA at Vcc = 5V, fCLK = 5 MHz, Ta = 25°C
Access Time (Typical)	Time from Address Valid to Data Valid	80 ns at Vcc = 5V, Ta = 25°C
Programming Voltage (Vpp)	Programming Voltage for Writing Data	12.5V to 13.5V
Programming Time	Time Required for Programming a Single Byte	2 ms typical, 10 ms maximum
Erase Time	Time Required for Full Chip Erase	20 seconds typical, 30 seconds maximum
Temperature Range	Operating Temperature	-40°C to +85°C
Storage Temperature	Storage Temperature	-65°C to +150°C
Endurance	Number of Write/Erase Cycles	1,000 cycles minimum
Data Retention	Guaranteed Data Retention Time	10 years minimum at Ta = 25°C

Instructions

1. Power Supply:

   • Connect Vcc to a stable 5V supply.
   • Connect Vss to ground.

2. Programming:

   • Apply Vpp (12.5V to 13.5V) to the appropriate pin during programming.
   • Use a programmer that supports the M27C4002-80XF1 device.
   • Follow the specific programming algorithm provided by the manufacturer.

3. Erase:

   • Expose the device to UV light for 20 to 30 seconds to erase the entire chip.
   • Ensure the UV window is not obstructed.

4. Reading Data:

   • Apply a valid address to the address lines.
   • Assert the chip enable (CE) and output enable (OE) signals.
   • Data will be available on the data lines after the access time.

5. Handling:

   • Handle the device with care to avoid static discharge.
   • Store in a dry, cool place when not in use.

6. Testing:

   • Verify the device functionality using a memory tester or a microcontroller.
   • Ensure all connections are secure and free of shorts.

7. Soldering:

   • Use a temperature-controlled soldering iron.
   • Avoid excessive heat and prolonged soldering times to prevent damage.

8. Environmental Considerations:

   • Ensure the operating environment is within the specified temperature range.
   • Protect the device from moisture and corrosive environments.

(For reference only)