Details
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Parameter | Symbol | Min | Typ | Max | Unit | Notes |
---|---|---|---|---|---|---|
Drain-Source Voltage | VDS | - | - | 200 | V | Continuous |
Gate-Source Voltage | VGS | -15 | - | 15 | V | Continuous |
Drain Current | ID | - | 15 | - | A | @ VGS = 10V, TJ = 25°C |
Power Dissipation | PD | - | - | 150 | W | @ TC = 25°C |
Junction Temperature | TJ | -55 | - | 175 | °C | Operating Range |
Storage Temperature | TSTG | -65 | - | 150 | °C | Storage Range |
Thermal Resistance | RθJC | - | 0.8 | - | °C/W | Junction to Case |
Input Capacitance | Ciss | - | 1300 | - | pF | @ VDS = 200V, f = 1 MHz |
Output Capacitance | Coss | - | 100 | - | pF | @ VDS = 200V, f = 1 MHz |
Reverse Transfer Capacitance | Crss | - | 300 | - | pF | @ VDS = 200V, f = 1 MHz |
Turn-On Delay Time | td(on) | - | 12 | - | ns | @ ID = 15A, VGS = 10V, RG = 1Ω |
Rise Time | tr | - | 24 | - | ns | @ ID = 15A, VGS = 10V, RG = 1Ω |
Turn-Off Delay Time | td(off) | - | 15 | - | ns | @ ID = 15A, VGS = 10V, RG = 1Ω |
Fall Time | tf | - | 35 | - | ns | @ ID = 15A, VGS = 10V, RG = 1Ω |
Instructions for Use:
Mounting:
- Ensure proper heat sinking to manage the power dissipation.
- Use a thermal compound between the device and the heatsink to improve thermal conductivity.
Gate Drive:
- Apply a gate-source voltage (VGS) within the specified range to control the MOSFET.
- Use a gate resistor (RG) to control the switching speed and reduce EMI.
Operating Conditions:
- Keep the junction temperature (TJ) within the operating range to avoid thermal damage.
- Ensure the drain-source voltage (VDS) does not exceed the maximum rating to prevent breakdown.
Storage:
- Store the device in a dry, cool environment within the specified storage temperature range.
Handling:
- Handle with care to avoid mechanical stress on the leads and body.
- Use proper ESD protection to prevent damage from static electricity.
Testing:
- Perform all tests under controlled conditions to ensure accurate results.
- Refer to the datasheet for specific test conditions and procedures.
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