Details

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BUY SKIIP 23NAB126V20 https://www.utsource.net/itm/p/12596388.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Collector-Emitter Voltage	VCE	-	-	1200	V	Maximum voltage between collector and emitter
Collector Current	IC	-	-	600	A	Continuous collector current
Power Dissipation	PT	-	-	4500	W	Maximum power dissipation
Junction Temperature	TJ	-25	-	175	掳C	Operating junction temperature range
Storage Temperature	TSTG	-55	-	150	掳C	Storage temperature range
Turn-On Time	ton	-	0.9	1.5	渭s	Time from gate trigger to collector current
Turn-Off Time	toff	-	1.2	2.0	渭s	Time from gate turn-off to collector current off
Gate Emitter Voltage	VGE	-15	-	20	V	Maximum gate-emitter voltage
Gate Current	IG	-	-	10	A	Maximum gate current
Thermal Resistance	Rth(j-c)	-	0.02	0.04	K/W	Thermal resistance from junction to case

Instructions for Use:

1. Mounting and Handling:

   • Ensure proper heat sinking to manage thermal resistance.
   • Handle with care to avoid mechanical damage.

2. Electrical Connections:

   • Connect the collector to the high-voltage side of the circuit.
   • Connect the emitter to the low-voltage side of the circuit.
   • Apply the gate signal carefully to avoid exceeding the maximum gate-emitter voltage.

3. Thermal Management:

   • Monitor the junction temperature to ensure it does not exceed 175掳C.
   • Use appropriate cooling solutions such as heatsinks or forced air cooling.

4. Operational Parameters:

   • Do not exceed the maximum collector current (600A) or collector-emitter voltage (1200V).
   • Ensure the power dissipation does not exceed 4500W.

5. Storage:

   • Store in a dry, cool place within the temperature range of -55掳C to 150掳C.

6. Testing:

   • Perform initial testing at reduced voltages and currents to ensure proper operation.
   • Regularly check the device parameters to ensure they remain within specified limits.

7. Safety:

   • Always follow safety guidelines when working with high-voltage and high-current circuits.
   • Use appropriate personal protective equipment (PPE) and grounding techniques.

(For reference only)