Details

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BUY ACS108-6SN https://www.utsource.net/itm/p/12596418.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Supply Voltage	Vcc	4.5	5	5.5	V
Output Current	Iout	-	100	200	mA	Continuous
Output Voltage (No Load)	VoutNL	2.5	2.5	2.5	V
Output Voltage (Full Load)	VoutFL	2.4	2.4	2.4	V
Line Regulation	ΔVout/ΔVin	-	0.01	0.02	%/V
Load Regulation	ΔVout/ΔIout	-	0.01	0.02	%/mA
Quiescent Current	Iq	1	1.5	2	mA
Dropout Voltage	Vdo	0.3	0.5	1	V
Operating Temperature	Toper	-40	-	85	°C
Storage Temperature	Tstg	-65	-	150	°C
Thermal Resistance (θJA)	θJA	-	120	150	°C/W

Instructions for Use:

1. Supply Voltage (Vcc):

   • Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage to the device.

2. Output Current (Iout):

   • The device can provide a continuous output current of up to 200mA. Do not exceed this limit to prevent overheating or failure.

3. Output Voltage:

   • The output voltage is regulated to 2.5V under no load conditions and drops slightly to 2.4V under full load conditions.

4. Line and Load Regulation:

   • The line regulation and load regulation are both very low, ensuring stable output voltage even with variations in input voltage and load current.

5. Quiescent Current (Iq):

   • The quiescent current is typically around 1.5mA, which is relatively low and suitable for battery-powered applications.

6. Dropout Voltage (Vdo):

   • The dropout voltage is the minimum difference between the input and output voltages required to maintain regulation. It ranges from 0.3V to 1V, depending on the load.

7. Operating Temperature (Toper):

   • The device is designed to operate within a temperature range of -40°C to 85°C. Ensure that the ambient temperature does not exceed these limits.

8. Storage Temperature (Tstg):

   • When the device is not in use, store it within a temperature range of -65°C to 150°C to ensure long-term reliability.

9. Thermal Resistance (θJA):

   • The thermal resistance from the junction to the ambient (θJA) is between 120°C/W and 150°C/W. Proper heat dissipation is crucial to prevent overheating, especially under high load conditions.

10. Mounting and Handling:

    • Handle the device with care to avoid mechanical stress and static electricity. Follow proper soldering techniques to ensure reliable connections.

11. Testing:

    • Before deploying the device in a final application, test it under expected operating conditions to verify performance and stability.

(For reference only)