Details

---

BUY S216S02F SHARP https://www.utsource.net/itm/p/12596429.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	2.7	-	5.5	V
Output Current	IOL	VOUT = 0.4V, VCC = 3.3V	8	-	-	mA
Output Current	IOH	VOUT = 3.3V - 0.4V, VCC = 3.3V	-	-	-0.8	mA
Input Voltage (High)	VIH	-	2.0	-	5.5	V
Input Voltage (Low)	VIL	-	0	-	0.8	V
Leakage Current	IIK	VIN = 0V, VCC = 3.3V	-1	-	1	渭A
Operating Temperature	TOPR	-	-40	-	85	掳C
Storage Temperature	TSTG	-	-55	-	125	掳C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (VCC) is within the range of 2.7V to 5.5V.
   • Use a stable power source to avoid voltage fluctuations that can affect performance.

2. Input Signals:

   • For a high input signal (VIH), the voltage should be between 2.0V and 5.5V.
   • For a low input signal (VIL), the voltage should be between 0V and 0.8V.
   • Avoid exceeding these voltage levels to prevent damage to the component.

3. Output Signals:

   • When the output is low (IOL), the current should not exceed 8mA at VOUT = 0.4V.
   • When the output is high (IOH), the current should not exceed -0.8mA at VOUT = 3.3V - 0.4V.

4. Leakage Current:

   • The leakage current (IIK) should be kept within 卤1渭A when VIN = 0V and VCC = 3.3V.

5. Temperature Considerations:

   • The operating temperature (TOPR) should be maintained between -40掳C and 85掳C.
   • The storage temperature (TSTG) should be kept between -55掳C and 125掳C to ensure long-term reliability.

6. Handling:

   • Handle the component with care to avoid static discharge, which can damage the device.
   • Follow proper soldering techniques to ensure reliable connections and avoid thermal stress.

7. Mounting:

   • Ensure proper alignment and orientation during mounting to prevent short circuits or incorrect connections.
   • Use recommended PCB layout guidelines to optimize performance and minimize interference.

(For reference only)